Unknown Plasma Enhanced Atomic Layer Deposition Film Publications

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NumberTitle
1(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
23D-Branched ZnO/CdS Nanowire Arrays for Solar Water Splitting and the Service Safety Research
3600 V High-Performance AlGaN/GaN HEMTs with AlN/SiNx Passivation
4650-V Double-Channel Lateral Schottky Barrier Diode With Dual-Recess Gated Anode
5823-mA/mm Drain Current Density and 945-MW/cm2 Baliga's Figure-of-Merit Enhancement-Mode GaN MISFETs With a Novel PEALD-AlN/LPCVD-Si3N4 Dual-Gate Dielectric
6A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
7A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
8A PEALD Tunnel Dielectric for Three-Dimensional Non-Volatile Charge-Trapping Technology
9A scaled replacement metal gate InGaAs-on-Insulator n-FinFET on Si with record performance
10A study of the impact of in-situ argon plasma treatment before atomic layer deposition of Al2O3 on GaN based metal oxide semiconductor capacitor
11A sub-1-volt analog metal oxide memristive-based synaptic device with large conductance change for energy-efficient spike-based computing systems
12A wearable multiplexed silicon nonvolatile memory array using nanocrystal charge confinement
13AC-Capacitance Techniques for Interface Trap Analysis in GaN-Based Buried-Channel MIS-HEMTs
14Al2O3 Insertion Layer for Improved PEALD SiO2/(Al)GaN Interfaces
15Al2O3/TiO2 nanolaminate gate dielectric films with enhanced electrical performances for organic field-effect transistors
16ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
17ALD-grown Ultrathin AlN Film for Passivation of AlGaN/GaN HEMTs
18AlGaN/GaN power schottky diodes with anode dimension up to 100 mm on 200 mm Si substrate
19AlN passivation by plasma-enhanced atomic layer deposition for GaN-based power switches and power amplifiers
20AlN/GaN heterostructure TFTs with plasma enhanced atomic layer deposition of epitaxial AlN thin film
21An improvement of HfO2/Ge interface by in situ remote N2 plasma pretreatment for Ge MOS devices
22An ultra-thin SiO2 ALD layer for void-free bonding of III-V material on silicon
23Anisotropic Inter-Poly Dielectric technology for conventional floating gate type flash memory
24Anti-stiction coating for mechanically tunable photonic crystal devices
25Atomic layer controlled deposition of silicon nitride with self-limiting mechanism
26Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
27Atomic Layer Deposition of AlN Thin Films in Three Different Growth Regimes
28Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
29Atomic layer deposition of B2O3/SiO2 thin films and their application in an efficient diffusion doping process
30Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
31Atomic layer deposition of Pd and Pt nanoparticles for catalysis: on the mechanisms of nanoparticle formation
32Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
33Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
34Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
35Atomic Layer Deposition of SiN for spacer applications in high-end logic devices
36Atomic layer deposition of tin oxide using tetraethyltin to produce high-capacity Li-ion batteries
37Atomic structure of conducting nanofilaments in TiO2 resistive switching memory
38Band alignment and electrical properties of Al2O3/β-Ga2O3 heterojunctions
39Bipolar resistive switching characteristics of low temperature grown ZnO thin films by plasma-enhanced atomic layer deposition
40Bipolar resistive switching in amorphous titanium oxide thin film
41Bipolar resistive switching properties of AlN films deposited by plasma-enhanced atomic layer deposition
42Capacitance spectroscopy of gate-defined electronic lattices
43Capacitance-voltage characterization of Al2O3/GaN-on-insulator (GaNOI) structures with TMAH surface treatment
44Carbon nanotube-supported Cu3N nanocrystals as a highly active catalyst for oxygen reduction reaction
45Characteristics of ALD-GZO Films with Driven-in Zn and Zn/Mg Sources for the Applications to Optoelectronic Devices
46Characteristics of Charge Trap Flash Memory with Al2O3/(Ta/Nb)Ox/Al2O3 Multi-Layer
47Characteristics of Metal-Oxide-Semiconductor Field-Effect Transistors with HfO2/SiO2/Si and HfO2/SiOxNy/Si Stack Structures Formed by Remote Plasma Technique
48Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
49Characterization of hafnium oxide resistive memory layers deposited on copper by atomic layer deposition
50Characterization of HfOxNy thin film formation by in-situ plasma enhanced atomic layer deposition using NH3 and N2 plasmas
51Characterization of SiNx/AlN passivation stack with epitaxial AlN grown on AlGaN/GaN heterojunctions by plasma-enhanced atomic layer deposition
52Charge effects of ultrafine FET with nanodot type floating gate
53Chemical Protection of Polycarbonate Surfaces by Atomic Layer Deposition of Alumina with Oxygen Plasma Pretreatment
54Chemical reactions during plasma-enhanced atomic layer deposition of SiO2 films employing aminosilane and O2/Ar plasma at 50°C
55Chemically-tunable ultrathin silsesquiazane interlayer for n-type and p-type organic transistors on flexible plastic
56CMOS-compatible Replacement Metal Gate InGaAs-OI FinFET With ION= 156 μA/μm at VDD= 0.5 V and IOFF= 100 nA/μm
57Co3O4 as Anode Material for Thin Film µBatteries prepared by Remote Plasma Atomic Layer Deposition
58Comparative study on interface and bulk charges in AlGaN/GaN metal-insulator-semiconductor heterostructures with Al2O3, AlN, and Al2O3/AlN laminated dielectrics
59Comparative study on nitridation and oxidation plasma interface treatment for AlGaN/GaN MIS-HEMTs with AlN gate dielectric
60Comparison of ammonia plasma and AlN passivation by plasma-enhanced atomic layer deposition
61Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
62Comparison of the Low-Frequency Noise of Bulk Triple-Gate FinFETs With and Without Dynamic Threshold Operation
63Compatibility of AlN/SiNx Passivation Technique with High-Temperature Process
64Compatibility of AlN/SiNx Passivation With LPCVD-SiNx Gate Dielectric in GaN-Based MIS-HEMT
65Conformal Formation of (GeTe2)(1-x)(Sb2Te3)x Layers by Atomic Layer Deposition for Nanoscale Phase Change Memories
66Controllable synthesis of molybdenum tungsten disulfide alloy for vertically composition-controlled multilayer
67Controlling the fixed charge and passivation properties of Si(100)/Al2O3 interfaces using ultrathin SiO2 interlayers synthesized by atomic layer deposition
68Controlling threshold voltage and leakage currents in vertical organic field-effect transistors by inversion mode operation
69Correlation of interface states/border traps and threshold voltage shift on AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors
70Coupled used of SKP and C-V measurements to highlight the charge distribution and behavior in the Si/SiO2/Al2O3 stack for silicon solar cells surface passivation
71Detailed Atomistic Modeling of Si(110) Passivation by Atomic Layer Deposition of Al2O3
72Detecting structural variances of Co3O4 catalysts by controlling beam-induced sample alterations in the vacuum of a transmission electron microscope
73Detection of Streptavidin-Biotin Complexes Using a Highly Sensitive AlGaN/GaN-Based Extended-Gate MISHEMT-Type Biosensor
74Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
75Device performance tuning of Ge gate-all-around tunneling field effect transistors by means of GeSn: Potential and challenges
76Device Performances Related to Gate Leakage Current in Al2O3/AlGaN/GaN MISHFETs
77DFT modeling of plasma-assisted atomic layer deposition for Si(110) passivation: formation of boehmite-like chains as γ-Al2O3 precursors
78DIBL in enhanced dynamic threshold operation of UTBB SOI with different drain engineering at high temperatures
79Direct deposition of aluminum oxide gate dielectric on graphene channel using nitrogen plasma treatment
80Direct measurement of coherent phonon dynamics in solution-processed stibnite thin films
81Disrupted Attosecond Charge Carrier Delocalization at a Hybrid Organic/Inorganic Semiconductor Interface
82Distribution and coverage of 40 nm gold nano-particles on aluminum and hafnium oxide using electrophoretic method and fabricated MOS structures
83Dynamic threshold voltage influence on Ge pMOSFET hysteresis
84Dynamic tuning of plasmon resonance in the visible using graphene
85Effect of Al2O3 Buffer Layers on the Properties of Sputtered VO2 Thin Films
86Effect of Al2O3 insertion on the electrical properties of SrTiO3 thin films: A comparison between Al2O3-doped SrTiO3 and SrTiO3/Al2O3/SrTiO3 sandwich structure
87Effect of an Al2O3/TiO2 Passivation Layer on the Performance of Amorphous Zinc-Tin Oxide Thin-Film Transistors
88Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
89Effect of Fluoride-based Plasma Treatment on the Performance of AlGaN/GaN MISHFET
90Effect of Hydrogen in Gate Insulator on NBIS Performance of Oxide Thin Film Transistor
91Effect of hydrogen peroxide pretreatment on ZnO-based metal-semiconductor-metal ultraviolet photodetectors deposited using plasma-enhanced atomic layer deposition
92Effect of Plasma Power of Plasma Enhanced Atomic Layer Deposition Process for Gate Insulator Deposition in Top-Gate Thin-Film Transistors
93Effect of process parameters on surface morphology and characterization of PE-ALD SnO2 thin films for gas sensing
94Effect of Reaction Mechanism on Precursor Exposure Time in Atomic Layer Deposition of Silicon Oxide and Silicon Nitride
95Effective work function modulation of the bilayer metal gate stacks by the Hf-doped thin TiN interlayer prepared by the in-situ atomic layer doping technique
96Effects of N2 RPN on the Structural and Electrical Characteristics of Remote Plasma Atomic Layer-Deposited HfO2 Films
97Effects of Cl-Based Ligand Structures on Atomic Layer Deposited HfO2
98Effects of interface oxidation on the transport behavior of the two-dimensional-electron-gas in AlGaN/GaN heterostructures by plasma-enhanced-atomic-layer-deposited AlN passivation
99Effects of N2 remote plasma nitridation on the structural and electrical characteristics of the HfO2 gate dielectrics grown using remote plasma atomic layer deposition methods
100Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
101Effects of rapid thermal annealing on the properties of HfO2/La2O3 nanolaminate films deposited by plasma enhanced atomic layer deposition
102Effects of Remote Plasma Pre-oxidation of Si Substrates on the Characteristics of ALD-Deposited HfO2 Gate Dielectrics
103Effects of surface nature of different semiconductor substrates on the plasma enhanced atomic layer deposition growth of Al2O3 gate dielectric thin films
104Effects of Surface Passivation and Deposition Methods on the 1/f Noise Performance of AlInN/AlN/GaN High Electron Mobility Transistors
105Effects of TiO2 Interfacial Atomic Layers on Device Performances and Exciton Dynamics in ZnO Nanorod Polymer Solar Cells
106Efficiency enhancement of InGaN/GaN blue light-emitting diodes with top surface deposition of AlN/Al2O3
107Electrical and chemical characterization of Al2O3 passivation layer deposited by plasma-assisted atomic layer deposition in c-Si solar cells
108Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
109Electrical and physical characteristics of high-k gated MOSFETs with in-situ H2O and O2 plasma formed interfacial layer
110Electrical characteristics and step coverage of ZrO2 films deposited by atomic layer deposition for through-silicon via and metal-insulator-metal applications
111Electrical Characteristics of Multilayer MoS2 FET's with MoS2/Graphene Heterojunction Contacts
112Electrical Characteristics of n, p-In0.53Ga0.47As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
113Electrical Characteristics of p-Type Bulk Si Fin Field-Effect Transistor Using Solid-Source Doping With 1-nm Phosphosilicate Glass
114Electrical characterization and reliability analysis of Al2O3/AlGaN/GaN MISH structure
115Electrical characterization of the slow boron oxygen defect component in Czochralski silicon
116Electrical characterizations of MIS structures based on variable-gap n(p)-HgCdTe grown by MBE on Si(0 1 3) substrates
117Electrical Measurement Under Atmospheric Conditons of PbSe Nanocrystal Thin Films Passivated by Remote Plasma Atomic Layer Deposition of Al2O3
118Electrodynamic response and local tunneling spectroscopy of strongly disordered superconducting TiN films
119Electron channel mobility in silicon-doped Ga2O3 MOSFETs with a resistive buffer layer
120Electron Transport Across Ultrathin Ferroelectric Hf0.5Zr0.5O2 Films on Si
121Electronic Conduction Mechanisms in Insulators
122Electronic Instabilities Leading to Electroformation of Binary Metal Oxide-based Resistive Switches
123Energy transformation of plasmonic photocatalytic oxidation on 1D quantum well of platinum thin film
124Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
125Enhanced electrical and reliability characteristics in HfON gated Ge p-MOSFETs with H2 and NH3 plasma treated interfacial layers
126Enhanced electrochemical performance of surface-treated Li[Ni0.8Co0.1Mn0.1]O2 cathode material for lithium-ion batteries
127Enhanced Methanol Oxidation with Annealed Atomic Layer Deposited Platinum Nanoparticles on Carbon Nanotubes
128Enhancement of barrier properties of aluminum oxide layer by optimization of plasma-enhanced atomic layer deposition process
129Enhancement of mobility in ultra-thin-body GeOI p-channel metal-oxide-semiconductor field effect transistors with Si-passivated back interfaces
130Enhancement of reliability and stability for transparent amorphous indium-zinc-tin-oxide thin film transistors
131Enhancement of the Electrical Properties of Ga-doped ZnO Thin Films on Polycarbonate Substrates by Using a TiO2 Buffer Layer
132Enhancement-mode AlGaN/GaN MIS-HEMTs with low threshold voltage hysteresis using damage-free neutral beam etched gate recess
133Epitaxial 1D electron transport layers for high-performance perovskite solar cells
134Evaluation of Low Temperature Silicon Nitride Spacer for High-k Metal Gate Integration
135Evaluation of NbN thin films grown by MOCVD and plasma-enhanced ALD for gate electrode application in high-k/SiO2 gate stacks
136Evaluation of Stress Induced by Plasma Assisted ALD SiN Film
137Evaluation of Thermal Versus Plasma-Assisted ALD Al2O3 as Passivation for InAlN/AlN/GaN HEMTs
138Evaluation of V2O5 Coatings Grown By Plasma Enhanced and Thermal Atomic Layer Deposition
139Experimental verification of electro-refractive phase modulation in graphene
140Extensionless UTBB FDSOI Devices in Enhanced Dynamic Threshold Mode under Low Power Point of View
141Fabrication and Characterization of an Extended-Gate AlGaN/GaN-Based Heterostructure Field-Effect Transistor-Type Biosensor for Detecting Immobilized Streptavidin-Biotin Protein Complexes
142Fabrication of Highly Ordered and Well-Aligned PbTiO3/TiN Core-Shell Nanotube Arrays
143Fabrication of nanodamascene metallic single electron transistors with atomic layer deposition of tunnel barrier
144Fabrication of self-aligned TFTs with a ultra-low temperature polycrystalline silicon process on metal foils
145Fabrication of Si3N4-Based Artificial Basilar Membrane with ZnO Nanopillar Using MEMS Process
146Fast Flexible Plastic Substrate ZnO Circuits
147Fermi level unpinning of GaSb (100) using plasma enhanced atomic layer deposition of Al2O3
148Ferroelectric properties of full plasma-enhanced ALD TiN/La:HfO2/TiN stacks
149Ferroelectricity of HfZrO2 in Energy Landscape With Surface Potential Gain for Low-Power Steep-Slope Transistors
150Field-Plated Ga2O3 MOSFETs With a Breakdown Voltage of Over 750 V
151Flexible integrated circuits and multifunctional electronics based on single atomic layers of MoS2 and graphene
152Flexible Technologies for Self-Powered Wearable Health and Environmental Sensing
153Fluorinated polymer-grafted organic dielectrics for organic field-effect transistors with low-voltage and electrical stability
154Formation of Ni silicide from atomic layer deposited Ni
155Forming-free metal-oxide ReRAM by oxygen ion implantation process
156Fully CMOS BEOL compatible HfO2 RRAM cell, with low (μA) program current, strong retention and high scalability, using an optimized plasma enhanced atomic layer deposition (PEALD) process for TiN electrode
157Fundamental reaction of RT gallium oxide atomic layer deposition investigated by IR absorption spectroscopy
158Ga2O3 MOSFETs Using Spin-On-Glass Source/Drain Doping Technology
159GaN Nanowire MOSFET With Near-Ideal Subthreshold Slope
160Gate Insulator for High Mobility Oxide TFT
161Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer
162Graphene based on-chip variable optical attenuator operating at 855 nm wavelength
163Graphene oxide monolayers as atomically thin seeding layers for atomic layer deposition of metal oxides
164Graphene photodetectors with a bandwidth >76 GHz fabricated in a 6" wafer process line
165Graphene-based bimorphs for micron-sized, autonomous origami machines
166Graphene-based MMIC process development and RF passives design
167Growth and characterization of titanium oxide by plasma enhanced atomic layer deposition
168Growth behavior and structural characteristics of TiO2 thin films using (CpN)Ti(NMe2)2 and oxygen remote plasma
169Growth kinetics for temperature-controlled atomic layer deposition of GaN using trimethylgallium and remote-plasma-excited NH3
170Growth of amorphous zinc tin oxide films using plasma-enhanced atomic layer deposition from bis(1-dimethylamino-2-methyl-2propoxy)tin, diethylzinc, and oxygen plasma
171Growth of silica nanowires in vacuum
172Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
173Growth of ZnO nanorods on fluorine-doped tin oxide substrate without catalyst by radio-frequency magnetron sputtering
174Half-wave phase retarder working in transmission around 630nm realized by atomic layer deposition of sub-wavelength gratings
175Hanle-effect measurements of spin injection from Mn5Ge3C0.8/Al2O3-contacts into degenerately doped Ge channels on Si
176High Energy Density Capacitor By Plasma-Treated ALD BaTiO3 Thin Films
177High Mobility (210cm2/Vs), High Capacitance (7.2uF/cm2) ZrO2 on GaN Metal Oxide Semiconductor Capacitor via ALD
178High mobility polycrystalline indium oxide thin-film transistors by means of plasma-enhanced atomic layer deposition
179High performance AlGaN/GaN HEMTs with AlN/SiNx passivation
180High Performance and Low power Monolithic Three-Dimensional Sub-50 nm Poly Si Thin film transistor (TFTs) Circuits
181High Performance CoOx/Si Photoanodes: Accessing Structural Disorder for Improved Catalytic Activity via Atomic Layer Deposition
182High performance graphene field effect transistors on an aluminum nitride substrate with high surface phonon energy
183High pulsed current density β-Ga2O3 MOSFETs verified by an analytical model corrected for interface charge
184High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
185High-density plasma etching characteristics of indium-gallium-zinc oxide thin films in CF4/Ar plasma
186High-Mobility Indium Oxide Thin-Film Transistors by Means of Plasma-Enhanced Atomic Layer Deposition
187High-performance normally off AlGaN/GaN-on-Si HEMTs with partially recessed SiNx MIS structure
188Highly efficient and bending durable perovskite solar cells: toward a wearable power source
189Highly reflective polymeric substrates functionalized utilizing atomic layer deposition
190Highly transparent low capacitance plasma enhanced atomic layer deposition Al2O3-HfO2 tunnel junction engineering
191Highly Uniform, Electroforming-Free, and Self-Rectifying Resistive Memory in the Pt/Ta2O5/HfO2-x/TiN Structure
192Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
193Hot-wire assisted ALD of tungsten films: In-situ study of the interplay between CVD, etching, and ALD modes
194Hydrogen induced passivation of Si interfaces by Al2O3 films and SiO2/Al2O3 stacks
195Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO2/In0.53Ga0.47As Gate-Stack
196Impact of gate insulator on the dc and dynamic performance of AlGaN/GaN MIS-HEMTs
197Impact of oxygen plasma on nitrided and annealed atomic layer deposited SiO2/high-k/metal gate for high-voltage input and output fin-shaped field effect transistor devices
198Impacts of conduction band offset and border traps on Vth instability of gate recessed normally-off GaN MIS-HEMTs
199Impedance spectroscopy analysis on the effects of TiO2 interfacial atomic layers in ZnO nanorod polymer solar cells: Effects of interfacial charge extraction on diffusion and recombination
200Improved Interface and Transport Properties of AlGaN/GaN MIS-HEMTs With PEALD-Grown AlN Gate Dielectric
201Improved retention times in UTBOX nMOSFETs for 1T-DRAM applications
202Improved understanding of recombination at the Si/Al2O3 interface
203Improvement of interfacial and electrical properties of Al2O3/n-Ga0.47In0.53As for III-V impact ionization MOSFETs
204Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
205Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
206Improvement on the Passivation Effect of Al2O3 Layer Deposited by PA-ALD in Crystalline Silicon Solar Cells
207In situ atomic layer nitridation on the top and down regions of the amorphous and crystalline high-K gate dielectrics
208In-system photoelectron spectroscopy study of tin oxide layers produced from tetrakis(dimethylamino)tin by plasma enhanced atomic layer deposition
209Increment of dielectric properties of SrTiO3 thin films by SrO interlayer on Ru bottom electrodes
210Industrially relevant Al2O3 deposition techniques for the surface passivation of Si solar cells
211Influence of Al2O3 Gate Dielectric on Transistor Properties for IGZO Thin Film Transistor
212Influence of Al2O3 layer insertion on the electrical properties of Ga-In-Zn-O thin-film transistors
213Influence of infrared radiation on the electrical characteristics of the surface-barrier nanostructures based on MBE HgCdTe
214Influence of Pre and Post-treatments on Plasma Enhanced ALD SiO2 and Al2O3 layers on GaN
215Influence of the charge trap density distribution in a gate insulator on the positive-bias stress instability of amorphous indium-gallium-zinc oxide thin-film transistors
216Initial evaluation and comparison of plasma damage to atomic layer carbon materials using conventional and low Te plasma sources
217Initial reaction of hafnium oxide deposited by remote plasma atomic layer deposition method
218Integrated Semiconductor/Catalyst Assemblies for Sustained Photoanodic Water Oxidation
219Interaction of hydrogen with hafnium dioxide grown on silicon dioxide by the atomic layer deposition technique
220Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
221Interface effect on dielectric constant of HfO2/Al2O3 nanolaminate films deposited by plasma-enhanced atomic layer deposition
222Interface engineering of an AlNO/AlGaN/GaN MIS diode induced by PEALD alternate insertion of AlN in Al2O3
223Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
224Interfaces of high-k dielectrics on GaAs: Their common features and the relationship with Fermi level pinning
225Investigating the interface characteristics of high-k ZrO2/SiO2 stacked gate insulator grown by plasma-enhanced atomic layer deposition for improving the performance of InSnZnO thin film transistors
226Investigation of Bulk and DTMOS triple-gate devices under 60 MeV proton irradiation
227Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
228IrO2 Nanodot Formation by Plasma Enhanced Atomic Layer Deposition as a Charge Storage Layer
229Junction-less nanowire based photodetector: Role of nanowire width
230Junctionless Gate-All-Around pFETs Using In-situ Boron-Doped Ge Channel on Si
231Kinetics of the permanent deactivation of the boron-oxygen complex in crystalline silicon as a function of illumination intensity
232Leakage and trapping characteristics in Au-free AlGaN/GaN Schottky barrier diodes fabricated on C-doped buffer layers
233Leakage Current Reduction in ALD-Al2O3 Dielectric Deposited on Si by High Pressure Deuterium Oxide Annealing
234Lifetimes exceeding 1ms in 1-Ohm-cm boron-doped Cz-silicon
235Light-induced activation and deactivation of bulk defects in boron-doped float-zone silicon
236Liquid-phase-deposited siloxane-based capping layers for silicon solar cells
237Liquids on-chip: direct storage and release employing micro-perforated vapor barrier films
238Low Current Collapse and Low Leakage GaN MIS-HEMT Using AlN/SiN as Gate Dielectric and Passivation Layer
239Low Dit HfO2/Al2O3/In0.53Ga0.47As gate stack achieved with plasma-enhanced atomic layer deposition
240Low Resistive Edge Contacts to CVD-Grown Graphene Using a CMOS Compatible Metal
241Low temperature plasma-enhanced ALD enables cost-effective spacer defined double patterning (SDDP)
242Low-temperature atomic layer epitaxy of AlN ultrathin films by layer-by-layer, in-situ atomic layer annealing
243Low-temperature plasma-enhanced atomic layer deposition of HfO2/Al2O3 nanolaminate structure on Si
244Low-thermal budget flash light annealing for Al2O3 surface passivation
245Mesoporous perovskite solar cells and the role of nanoscale compact layers for remarkable all-round high efficiency under both indoor and outdoor illumination
246Metal-insulator-semiconductor structure using Ga2O3 layer by plasma enhanced atomic layer deposition
247Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
248Method of sealing pores in porous low-k SiOC(-H) films fabricated using plasma-assisted atomic layer deposition
249Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
250Micro-Raman Spectroscopy for Monitoring of Deposition Quality of High-k Stack Protective Layer onto Nanowire FET Chips for Highly Sensitive miRNA Detection
251Minority carrier lifetime limitations in Si wafer solar cells with gallium phosphide window layers
252Moisture barrier and chemical corrosion protection of silver-based telescope mirrors using aluminum oxide films by plasma-enhanced atomic layer deposition
253Multi-functional touch sensors with strained P(VDF-TrFE) deposited on metal oxide thin film transistor
254Nanochemistry, nanostructure, and electrical properties of Ta2O5 film deposited by atomic layer deposition and plasma-enhanced atomic layer deposition
255Nanoscopic structural rearrangements of the Cu-filament in conductive-bridge memories
256Negative differential resistance in the I-V curves of Al2O3/AlGaN/GaN MIS structures
257New grating concepts in the NIR and SWIR spectral band for high resolution earth-observation spectrometers
258New materials for memristive switching
259Nitride memristors
260Non-destructive acoustic metrology and void detection in 3x50μm TSV
261Normally-off AlGaN/GaN recessed MOS-HEMTs on normally-on epitaxial structures for microwave power applications
262Normally-off AlGaN/GaN-on-Si metal-insulator-semiconductor heterojunction field-effect transistor with nitrogen-incorporated silicon oxide gate insulator
263On the composition of luminescence spectra from heavily doped p-type silicon under low and high excitation
264On the equilibrium concentration of boron-oxygen defects in crystalline silicon
265Optimization of Al2O3/TiO2 nanolaminate thin films prepared with different oxide ratios, for use in organic light-emitting diode encapsulation, via plasma-enhanced atomic layer deposition
266Optimization of the Surface Structure on Black Silicon for Surface Passivation
267Organic thin-film transistors with sub-10-micrometer channel length with printed polymer/carbon nanotube electrodes
268Oxidation precursor dependence of atomic layer deposited Al2O3 films in a-Si:H(i)/Al2O3 surface passivation stacks
269Oxide Vertical TFTs for the Application to the Ultra High Resolution Display
270Oxygen migration in TiO2-based higher-k gate stacks
271Partitioning Electrostatic and Mechanical Domains in Nanoelectromechanical Relays
272Passivation of Al2O3/TiO2 on monocrystalline Si with relatively low reflectance
273Patterning of silicon nitride for CMOS gate spacer technology. III. Investigation of synchronously pulsed CH3F/O2/He plasmas
274PEALD of Copper using New Precursors for Next Generation of Interconnections
275PEALD of HfO2 Thin Films: Precursor Tuning and a New Near-Ambient-Pressure XPS Approach to in Situ Examination of Thin-Film Surfaces Exposed to Reactive Gases
276PEALD YSZ-based bilayer electrolyte for thin film-solid oxide fuel cells
277Performance enhancement of normally-off Al2O3/AlN/GaN MOS-Channel-HEMTs with an ALD-grown AlN interfacial layer
278Performance of AlGaN/GaN MISHFET using dual-purpose thin Al2O3 layer for surface protection and gate insulator
279Performance Optimization of Au-Free Lateral AlGaN/GaN Schottky Barrier Diode With Gated Edge Termination on 200-mm Silicon Substrate
280Photo-Patternable ZnO Thin Films Based on Cross-Linked Zinc Acrylate for Organic/Inorganic Hybrid Complementary Inverters
281Photochemical Reaction Patterns on Heterostructures of ZnO on Periodically Poled Lithium Niobate
282Photoluminescence and electroluminescence from Ge/strained GeSn/Ge quantum wells
283Photovoltaic Rudorffites: Lead-Free Silver Bismuth Halides Alternative to Hybrid Lead Halide Perovskites
284Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
285Plasma enhanced atomic layer deposition of silicon nitride using neopentasilane
286Plasma Enhanced Atomic Layer Deposition of SiN:H Using N2 and Silane
287Plasma enhanced atomic layer deposition of SiNx:H and SiO2
288Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
289Plasma Enhanced Atomic Layer Deposition Passivated HfO2/AlN/In0.53Ga0.47As MOSCAPs With Sub-Nanometer Equivalent Oxide Thickness and Low Interface Trap Density
290Plasma nitridation of atomic layer deposition (ALD) Al2O3 by NH3 in plasma-enhanced chemical vapor deposition (PECVD) for silicon solar cell
291Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
292Plasma-Enhanced ALD of TiO2 Using a Novel Cyclopentadienyl Alkylamido Precursor [Ti(CpMe)(NMe2)3] and O2 Plasma
293Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
294Plasma-enhanced atomic layer deposition for antireflection coatings using SiO2 as low-refractive index material
295Plasma-enhanced atomic layer deposition for plasmonic TiN
296Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
297Plasma-Enhanced Atomic Layer Deposition Processed Amorphous Indium Zinc Oxide Thin-Film Transistor for Ultra-High Definition Display Application
298Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
299Poly-Si gate electrodes for AlGaN/GaN HEMT with high reliability and low gate leakage current
300Post Plasma Oxidation Processed ALD Al2O3/Hf1-xZrxO2 Thin Films on Ge Substrates: Reliability
301Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
302Properties of HfAlO film deposited by plasma enhanced atomic layer deposition
303Properties of HfLaO MOS capacitor deposited on SOI with plasma enhanced atomic layer deposition
304Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
305Pt/Ta2O5/HfO2-x/Ti Resistive Switching Memory Competing with Multilevel NAND Flash
306Reliability and failure physics of GaN HEMT, MIS-HEMT and p-gate HEMTs for power switching applications: Parasitic effects and degradation due to deep level effects and time-dependent breakdown phenomena
307Reliability and parasitic issues in GaN-based power HEMTs: a review
308Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
309Remote plasma atomic layer deposited Al2O3 4H-SiC MOS capacitor with remote H2 plasma passivation and post metallization annealing
310Room temperature CO2 detection using interdigitated capacitors with heteropolysiloxane sensing films
311RT Ga2O3 atomic layer deposition by using trimethylgallium and water-oxygen plasma
312Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
313Schottky Barrier Height Reduction at Interface Between GZO Transparent Electrode and InP/InGaAs Structure by Zinc Driven-in Step and Nickel Oxide Insertion
314Self-aligned ZnO thin-film transistors with 860 MHz fT and 2 GHz fmax for large-area applications
315Self-catalysis by aminosilanes and strong surface oxidation by O2 plasma in plasma-enhanced atomic layer deposition of high-quality SiO2
316Semiconductor-like nanofilms assembled with AlN and TiN laminations for nearly ideal graphene-based heterojunction devices
317Silicon film thickness influence on enhanced dynamic threshold UTBB SOI nMOSFETs
318Silicon nanowire networks for multi-stage thermoelectric modules
319Simultaneous Roll Transfer and Interconnection of Flexible Silicon NAND Flash Memory
320Simultaneous scanning tunneling microscopy and synchrotron X-ray measurements in a gas environment
321SiNx passivated GaN HEMT by plasma enhanced atomic layer deposition
322SnO2 nanotubes fabricated using electrospinning and atomic layer deposition and their gas sensing performance
323Spectroscopy and control of near-surface defects in conductive thin film ZnO
324Stability of effective lifetime of float-zone silicon wafers with AlOx surface passivation schemes under illumination at elevated temperature
325Steady-state Thermal Conductivity Measurement of Dielectric Stacks for Phase-Change Memory Power Reduction
326Stretchable Carbon Nanotube Charge-Trap Floating-Gate Memory and Logic Devices for Wearable Electronics
327Structural and electrical properties of ultra-thin high-k ZrO2 film on nitride passivated Ge(100) prepared by PEALD
328Structural characteristics of epitaxial SnO2 films deposited on a- and m-cut sapphire by ALD
329Study on the electrical characteristics of in situ PEALD-passivated HfO2/In0.53Ga0.47As MOSCAP and MOSFET structures
330Stuffing-enabled surface confinement of silanes used as sealing agents on CF4 plasma-exposed 2.0 p-OSG films
331Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode
332Surface and sensing properties of PE-ALD SnO2 thin film
333Surface Etching of TiO2 Thin Films Using High Density Cl2/Ar Plasma
334Surface oxidation model in plasma enhanced atomic layer deposition for silicon oxide films including various aminosilane precursors
335Surface treatments on AlGaN/GaN heterostructures for gate dielectric Al2O3 thin films grown by Atomic Layer Deposition
336Symmetrical Al2O3-based passivation layers for p- and n-type silicon
337Synaptic Plasticity and Learning Behaviors Mimicked in Single Inorganic Synapses of Pt/HfOx/ZnOx/TiN Memristive System
338Synthesis of Pt@TiO2@CNTs Hierarchical Structure Catalyst by Atomic Layer Deposition and Their Photocatalytic and Photoelectrochemical Activity
339Tailoring the Electrical Properties of HfO2 MOS-Devices by Aluminum Doping
340Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition
341Temperature-controlled atomic layer deposition of GaN using plasma-excited nitrogen source
342Terahertz Quantum Plasmonics of Nanoslot Antennas in Nonlinear Regime
343The effect of oxygen remote plasma treatment on ZnO TFTs fabricated by atomic layer deposition
344The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
345Theoretical and Experimental Investigation of Graphene/High-κ/p-Si Junctions
346Theoretical Understanding of the Reaction Mechanism of SiO2 Atomic Layer Deposition
347Thermal conductivity measurement of amorphous dielectric multilayers for phase-change memory power reduction
348Thin effective oxide thickness (~0.5 nm) and low leakage current gate dielectric for Ge MOS devices by plasma nitrided Al2O3 intermediate layer
349Threshold voltage controlled by gate area and gate recess in inverted trapezoidal trigate AlGaN/GaN MOS high-electron-mobility transistors with photoenhanced chemical and plasma-enhanced atomic layer deposition oxides
350TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
351Time-Dependent Breakdown Mechanisms and Reliability Improvement in Edge Terminated AlGaN/GaN Schottky Diodes Under HTRB Tests
352TiO2/Al2O3/TiO2 Nanolaminated Thin Films for DRAM Capacitor Deposited by Plasma-Enhanced Atomic Layer Deposition
353Total-dose radiation response and and post-irradiation annealing response of Hafnium capacitors
354Toward reliable MIS- and MOS-gate structures for GaN lateral power devices
355Toward Understanding Positive Bias Temperature Instability in Fully Recessed-Gate GaN MISFETs
356Transient characterization of the electroforming process in TiO2 based resistive switching devices
357Trapping and reliability issues in GaN-based MIS HEMTs with partially recessed gate
358Trilayer Tunnel Selectors for Memristor Memory Cells
359Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
360Tuning the phase transitions of VO2 thin films on silicon substrates using ultrathin Al2O3 as buffer layers
361Two-stage permanent deactivation of the boron-oxygen-related recombination center in crystalline silicon
362Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs
363Ultraviolet photodetector based on MgxZn1-xO films using plasma-enhanced atomic layer deposition
364Understanding and Eliminating Hysteresis for Highly Efficient Planar Perovskite Solar Cells
365Understanding and optimizing the floating body retention in FDSOI UTBOX
366Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
367Vertical Ge and GeSn heterojunction gate-all-around tunneling field effect transistors
368Via sidewall insulation for through cell via contacts
369Wafer-scale, conformal and direct growth of MoS2 thin films by atomic layer deposition
370Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors
371X-ray Photoelectron Spectroscopy Analyses of Atomic Layer Deposition-Prepared Titanium-Dioxide Thin Films with Oxygen Sources and Their Annealing Effect
372ZrO2-coated SiC nanowires prepared by plasma-enhanced atomic layer chemical vapor deposition


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