Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
Type:
Journal
Info:
Advanced Engineering Materials Volume 19, Issue 2, February 2017
Date:
2016-10-17
Author Information
| Name | Institution |
|---|---|
| Alexander Sasinska | University of Cologne |
| Daniel Ritschel | University of Cologne |
| Lisa Czympiel | University of Cologne |
| Sanjay Mathur | University of Cologne |
Films
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Substrates
Notes
| 950 |