Publication Information

Title:
Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
Type:
Journal
Info:
Advanced Engineering Materials Volume 19, Issue 2, February 2017
Date:
2016-10-17

Author Information

Name Institution
Alexander SasinskaUniversity of Cologne
Daniel RitschelUniversity of Cologne
Lisa CzympielUniversity of Cologne
Sanjay MathurUniversity of Cologne

Films

Plasma Cu


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Substrates

Keywords

Notes

950