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Cu Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Cu films returned 17 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
2Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
3Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
4Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
5Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
6Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
7Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
8Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
9Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
10PEALD of Copper using New Precursors for Next Generation of Interconnections
11Copper-ALD Seed Layer as an Enabler for Device Scaling
12Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
13Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
14Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
15Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
16Hydrogen plasma-enhanced atomic layer deposition of copper thin films
17Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer