Cu Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Cu films returned 17 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
2Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
3Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
4Hydrogen plasma-enhanced atomic layer deposition of copper thin films
5Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
6Copper-ALD Seed Layer as an Enabler for Device Scaling
7Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
8Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
9Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
10Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
11Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
12Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
13PEALD of Copper using New Precursors for Next Generation of Interconnections
14Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
15Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
16Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
17Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage