Cu Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Cu films returned 17 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

1Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
2Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
3Copper-ALD Seed Layer as an Enabler for Device Scaling
4Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
5Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
6Hydrogen plasma-enhanced atomic layer deposition of copper thin films
7Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
8Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
9Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
10Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
11Low temperature hydrogen plasma-assisted atomic layer deposition of copper studied using in situ infrared reflection absorption spectroscopy
12Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
13Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
14PEALD of Copper using New Precursors for Next Generation of Interconnections
15Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
16Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
17Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD