Publication Information

Title:
Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
Type:
Journal
Info:
Journal of The Electrochemical Society, 152 (2) C60-C64 (2005)
Date:
2004-07-12

Author Information

Name Institution
Christopher JezewskiState University of New York at Albany
W. A. LanfordState University of New York at Albany
Christopher J. WiegandRensselaer Polytechnic Institute (RPI)
J. P. SinghRensselaer Polytechnic Institute (RPI)
Pei-I WangRensselaer Polytechnic Institute (RPI)
Jay J. SenkevichRensselaer Polytechnic Institute (RPI)
Toh-Ming LuRensselaer Polytechnic Institute (RPI)

Films

Plasma Cu


Film/Plasma Properties

Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Adhesion
Analysis: Tape Test

Substrates

Ta
SiO2
Au
TaN

Keywords

Notes

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