Title: Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
Type: Journal
Info: Journal of The Electrochemical Society, 152 (2) C60-C64 (2005)
Date: 2004-07-12
DOI: http://dx.doi.org/10.1149/1.1850340
Name
Institution
State University of New York at Albany
State University of New York at Albany
Rensselaer Polytechnic Institute (RPI)
Rensselaer Polytechnic Institute (RPI)
Rensselaer Polytechnic Institute (RPI)
Rensselaer Polytechnic Institute (RPI)
Rensselaer Polytechnic Institute (RPI)
Characteristic
Analysis
Diagnostic
Density
RBS, Rutherford Backscattering Spectrometry
Unknown
Thickness
RBS, Rutherford Backscattering Spectrometry
Unknown
Chemical Composition, Impurities
RBS, Rutherford Backscattering Spectrometry
Unknown
Microstructure
TEM, Transmission Electron Microscope
Philips CM12
Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Electron Diffraction
Philips CM12
Morphology, Roughness, Topography
AFM, Atomic Force Microscopy
Veeco Autoprobe CP
Adhesion
Scotch Tape Test
Unknown
Ta
SiO2
Au
TaN
1170
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