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Inductively Coupled Hydrogen Plasma-Assisted Cu ALD on Metallic and Dielectric Surfaces
Type:
Journal
Info:
Journal of The Electrochemical Society, 152 (2) C60-C64 (2005)
Date:
2004-07-12
Author Information
| Name | Institution |
|---|---|
| Christopher Jezewski | State University of New York at Albany |
| W. A. Lanford | State University of New York at Albany |
| Christopher J. Wiegand | Rensselaer Polytechnic Institute (RPI) |
| J. P. Singh | Rensselaer Polytechnic Institute (RPI) |
| Pei-I Wang | Rensselaer Polytechnic Institute (RPI) |
| Jay J. Senkevich | Rensselaer Polytechnic Institute (RPI) |
| Toh-Ming Lu | Rensselaer Polytechnic Institute (RPI) |
Films
Plasma Cu
Film/Plasma Properties
Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Adhesion
Analysis: Tape Test
Substrates
| Ta |
| SiO2 |
| Au |
| TaN |
Notes
| 1170 |