Film and Plasma Characteristics in the Plasma Enhanced Atomic Layer Deposition Publication Database

A wide variety of films have been deposited using plasma enhanced atomic layer deposition. Film analysis is required to quantify the quality of a deposition process. Most films are characterized for thickness to determine growth per cycle. Film composition measurements including impurity concentration and stoichiometry are also common for all classes of films. Dielectric materials are often analylzed for permittivity, leakage current, and breakdown voltage. Conductive materials are often characterized by their resistivity/sheet resistance. Other properties may be characterized depending on whether the film will be utilized for other characteristics such as optical, electrical, mechanical, or diffusion barrier. The extensive list of film characteristics discussed in the literature reveals the broad range of applications researchers have sought for plasma enhanced atomic layer deposition films.


Below is a table which lists all the film characteristics which have been discussed in the publications included in the plasma-ald.com database. Click on the film characteristic to get a list of relevant publications.

Abrasion Resistance

Absorption Edges

Adhesion

Air Permeability

Area Selectivity

Areal Density

Band Alignment

Band Defects

Band Gap

Barrier Characteristics

Barrier Height

Battery Properties

Blistering

Bonding States

Border Trap Densities, NBT

Breakdown Voltage

Breakdown Voltage Lifetime

Built-in Voltage

Capacitance

Carrier Concentration

Catalysis

CET, capacitance equivalent thickness

Charge Capacity

Charge Retention Time

Chemical Binding

Chemical Composition, Impurities

Compositional Depth Profiling

Conductance

Conduction Band Edge States

Conduction Band Offset

Conductivity Type

Conformality, Step Coverage

Contact Resistance

Continuity

Core Energy Levels

Corrosion

Corrosion Current Density

Corrosion Potential

Critical Current Density

Critical Temperature

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

Current Density

Damage, Defects

Dark Current

DC Characteristics

Density

Depletion Layer Width

Deposition Kinetics, Reaction Mechanism

Dewetting

Dielectric Constant, Permittivity

Dielectric Function

Diffusion Barrier Properties

Dispersion

Dissipation Factors

Doping Density

Effective Charge Density

Effective Mass

Effective Oxide Charge, Qeff

Efficiency

Electrical Properties

Electrochemical Performance

Electron Affinitiy

Electron Density, ne

Electron Field Emission

Electron Mobility

Electron Paramagnetic Resonance

Electron Temperature, Te

Elemental Mapping

Emitter Saturation Current Density

Environmental Testing

EOT, Equivalent Oxide Thickness

ESR, Equivalent Series Resistance

Etch Rate

Evaporation Characteristics

Extinction Coefficient

Fermi Level Electronic Structure

Ferroelectricity

Fill Factor

Film Detection,Penetration

Film Stress

Film Structure

Fixed Charge

Fixed Charge Density

Flat Band Voltage

Flat Band Voltage Shift

Flexibility

Fowler-Nordheim (FN) Current Plots

Frequency Dispersion

Friction Coefficient

Gas Phase Species

Gas Sensing

Hall Voltage

Hardness

Humidity Sensor

Hydrogen Desorption

Hysteresis

I-V Plots

Ideality Factor

Images

Interface State Density

Interface Trap Density

Interfacial Contact Resistance

Interfacial Layer

Interlayer

Inversion Layer

Ion Energy

Ion Flux

IQE, Internal Quantum Efficiency

Laser Induced Damage Threshold, LIDT

Leakage Current

Lifetime

Loss Tangent

Magnetic Properties

Magnetization

Mechanical Properties

Memristor Characteristics

Microstructure

Microwave Properties

Midgap Voltage

Minority Carrier Lifetime

Mobile Charge Density

Mobility

Morphology, Roughness, Topography

NBTI, Negative Bias Temperature Instability

Near Band Emission (NBE)

Nucleation

OES

Off Current

On/Off Current Ratio

Open Circuit Voltage

Optical Absorption

Optical Band Edge

Optical Bandgap

Optical Dispersion

Optical Properties

Oxidation Resistance

Oxygen Transmission Rate (OTR)

Particle Size Distribution

Particle Surface Density

Passivation

Phonon Modes

Photocatalytic Activity

Photoconductance

Photocurrent

Photoelectrochemical (PEC) Activity

Photoluminescence

Photoresponse

Photovoltaic Performance

Piezoelectric properties

Plasma Damage

Plasma Species

Plasmon Resonances

Polarization

Poole-Frenkel Analysis

Pore Size Distribution

Porosity

Power Density

Precursor Characterization

Precursor Utilization

Precursor Vapor Pressure

Pulsed Transient Current Measurement

Quality Factor

Radiation Hardness

Raman Shift

Raman Spectra

Recovery Rate

Reflectance Spectra

Reflectivity

Refractive Index

Remanent Polarization

Resistive Switching

Resistivity, Sheet Resistance

Sample Preparation

Schottky Analysis

Self Cleaning

SERS

Sheet Inductance

Short Circuit Current

Stability

Stress

Substrate Impurity Concentration

Substrate Temperature

Subthreshold Slope

Subthreshold Swing

Superconductivity

Surface Defect Density

Surface Polarity

Surface Potential

Surface Reactions

Surface Recombination Velocity

TCR, Temperature Coefficient of Resistivity

Thermal Conductivity

Thermal Effusion

Thermal Stability

Thickness

Threading Dislocations

Threshold Voltage

Threshold Voltage Shift

Transconductance

Transfer Curves

Transistor Characteristics

Transmittance

Trapped Positive Charge-Density Change

Uniformity

Unknown

UV-Vis Transmission

VCPD - Contact Potential Difference

Valence Band

Valence Band Offset

Vibrational Properties

Voltage Nonlinearity Factor

Water Vapor Permeability (WVP)

Water Vapor Transmission Rate (WVTR)

Wear Rate

Wet Etch Resistance

Wetting Angle

Work Function

Young's Modulus



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