Resistivity, Sheet Resistance Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Resistivity, Sheet Resistance returned 256 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
3A controlled growth of WNx and WCx thin films prepared by atomic layer deposition
4A route to low temperature growth of single crystal GaN on sapphire
5Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
6Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
7All-oxide thin-film transistors with channels of mixed InOx-ZnOy formed by plasma-enhanced atomic layer deposition process
8Aluminum nitride thin films deposited by hydrogen plasma enhanced and thermal atomic layer deposition
9Analysis of NbN thin film deposition by plasma-enhanced ALD for gate electrode application
10Antiferromagnetism and p-type conductivity of nonstoichiometric nickel oxide thin films
11Approximation of PE-MOCVD to ALD for TiN Concerning Resistivity and Chemical Composition
12Atmospheric pressure plasma enhanced spatial ALD of silver
13Atmospheric pressure plasma enhanced spatial atomic layer deposition of SnOx as conductive gas diffusion barrier
14Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
15Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
16Atomic Layer Deposition Niobium Nitride Films for High-Q Resonators
17Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
18Atomic Layer Deposition of Cobalt Using H2-, N2-, and NH3-Based Plasmas: On the Role of the Co-reactant
19Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
20Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
21Atomic layer deposition of high-mobility hydrogen-doped zinc oxide
22Atomic layer deposition of platinum with enhanced nucleation and coalescence by trimethylaluminum pre-pulsing
23Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
24Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
25Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
26Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
27Atomic Layer Deposition of TiN/Al2O3/TiN Nanolaminates for Capacitor Applications
28Atomic layer deposition of titanium nitride for quantum circuits
29Atomic layer deposition of titanium nitride from TDMAT precursor
30Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
31Baking and plasma pretreatment of sapphire surfaces as a way to facilitate the epitaxial plasma-enhanced atomic layer deposition of GaN thin films
32Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
33Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
34Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
35Characteristics of ALD-GZO Films with Driven-in Zn and Zn/Mg Sources for the Applications to Optoelectronic Devices
36Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
37Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
38Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
39Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
40Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
41Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
42Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
43Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
44Comparison of gate dielectric plasma damage from plasma-enhanced atomic layer deposited and magnetron sputtered TiN metal gates
45Comparison of thermal, plasma-enhanced and layer by layer Ar plasma treatment atomic layer deposition of Tin oxide thin films
46Comparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor
47Compositional and electrical modulation of niobium oxide thin films deposited by plasma-enhanced atomic layer deposition
48Conformal Fe, Co and Ni Films from Oxides and Nitrides Grown by Atomic Layer Deposition
49Copper-ALD Seed Layer as an Enabler for Device Scaling
50Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
51Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
52Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
53Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
54Deposition of TiN and HfO2 in a commercial 200 mm remote plasma atomic layer deposition reactor
55Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
56Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
57Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
58Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
59Diffusion of Phosphorus and Boron from Atomic Layer Deposition Oxides into Silicon
60Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
61Effect of in situ hydrogen plasma treatment on zinc oxide grown using low temperature atomic layer deposition
62Effect of Oxygen Source on the Various Properties of SnO2 Thin Films Deposited by Plasma-Enhanced Atomic Layer Deposition
63Effect of the substrate on structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
64Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
65Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
66Electrical and structural properties of conductive nitride films grown by plasma enhanced atomic layer deposition with significant ion bombardment effect
67Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
68Electrodynamic response and local tunneling spectroscopy of strongly disordered superconducting TiN films
69Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
70Energetic ions during plasma-enhanced atomic layer deposition and their role in tailoring material properties
71Energy transformation of plasmonic photocatalytic oxidation on 1D quantum well of platinum thin film
72Enhanced photocatalytic performance in atomic layer deposition grown TiO2 thin films via hydrogen plasma treatment
73Enhancement of the Electrical Properties of Ga-doped ZnO Thin Films on Polycarbonate Substrates by Using a TiO2 Buffer Layer
74Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxy
75Epitaxial Growth of Cubic and Hexagonal InN Thin Films via Plasma-Assisted Atomic Layer Epitaxy
76Evaluation of plasma parameters on PEALD deposited TaCN
77Fermi Level Tuning of ZnO Films Through Supercycled Atomic Layer Deposition
78Film Uniformity in Atomic Layer Deposition
79Formation of Nano-Crystalline Ru-Based Ternary Thin Films by Plasma-Enhanced Atomic Layer Deposition
80Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
81Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
82Forming-free resistive switching of tunable ZnO films grown by atomic layer deposition
83Fully CMOS-compatible titanium nitride nanoantennas
84GeSbTe deposition for the PRAM application
85Growth and characterization of III-N ternary thin films by plasma assisted atomic layer epitaxy at low temperatures
86Growth and Characterization of Metastable Hexagonal Nickel Thin Films via Plasma-Enhanced Atomic Layer Deposition
87Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
88Growth of controllable ZnO film by atomic layer deposition technique via inductively coupled plasma treatment
89Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
90Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
91High mobility polycrystalline indium oxide thin-film transistors by means of plasma-enhanced atomic layer deposition
92High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
93High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
94High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition
95Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
96Highly Tunable Electrical Properties in Undoped ZnO Grown by Plasma Enhanced Thermal-ALD
97Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
98Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
99Hydrogen plasma-enhanced atomic layer deposition of copper thin films
100Improved electrical performances of plasma-enhanced atomic layer deposited TaCxNy films by adopting Ar/H2 plasma
101Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
102Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
103Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
104Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
105In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
106In situ spectroscopic ellipsometry study on the growth of ultrathin TiN films by plasma-assisted atomic layer deposition
107In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
108In vacuo studies on plasma-enhanced atomic layer deposition of cobalt thin films
109In-system photoelectron spectroscopy study of tin oxide layers produced from tetrakis(dimethylamino)tin by plasma enhanced atomic layer deposition
110Influence of atomic layer deposition valve temperature on ZrN plasma enhanced atomic layer deposition growth
111Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
112Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
113Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
114Investigating the TiN film quality and growth behavior for plasma-enhanced atomic layer deposition using TiCl4 and N2/H2/Ar radicals
115Lateral conductivity of n-GaP/p-Si heterojunction with an inversion layer
116Low resistivity HfNx grown by plasma-assisted ALD with external rf substrate biasing
117Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
118Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
119Low temperature plasma enhanced atomic layer deposition of conducting zirconium nitride films using tetrakis (dimethylamido) zirconium and forming gas (5% H2 + 95% N2) plasma
120Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
121Low Thermal Budget Heteroepitaxial Gallium Oxide Thin Films Enabled by Atomic Layer Deposition
122Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
123Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
124Low-Temperature Deposition of TiN by Plasma-Assisted Atomic Layer Deposition
125Low-Temperature Growth of Indium Oxide Thin Film by Plasma-Enhanced Atomic Layer Deposition Using Liquid Dimethyl(N-ethoxy-2,2-dimethylpropanamido)indium for High-Mobility Thin Film Transistor Application
126Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
127Low-Temperature Plasma-Assisted Atomic-Layer-Deposited SnO2 as an Electron Transport Layer in Planar Perovskite Solar Cells
128Low-temperature plasma-enhanced atomic layer deposition of tin oxide electron selective layers for highly efficient planar perovskite solar cells
129Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
130Microwave properties of superconducting atomic-layer deposited TiN films
131Multistep atomic layer deposition process for ultrathin superconducting NbN films with high critical current density on amorphous substrate
132Nanowire single-photon detectors made of atomic layer-deposited niobium nitride
133Ni80Fe20 nanotubes with optimized spintronic functionalities prepared by atomic layer deposition
134Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
135Nucleation mechanism during WS2 plasma enhanced atomic layer deposition on amorphous Al2O3 and sapphire substrates
136Obtaining low resistivity (~100 µΩ cm) TiN films by plasma enhanced atomic layer deposition using a metalorganic precursor
137Optimization of Plasma Enhanced Atomic Layer Deposition Processes for Oxides, Nitrides and Metals in the Oxford Instruments FlexAL Reactor
138PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
139PEALD of Copper using New Precursors for Next Generation of Interconnections
140Phase Control of Crystalline Ga2O3 Films by Plasma-Enhanced Atomic Layer Deposition
141Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
142Plasma enhanced atomic layer deposition of molybdenum carbide and nitride with bis(tert-butylimido)bis(dimethylamido) molybdenum
143Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
144Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
145Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
146Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases
147Plasma enhanced atomic layer deposition of ZnO with diethyl zinc and oxygen plasma: Effect of precursor decomposition
148Plasma treatment to tailor growth and photoelectric performance of plasma-enhanced atomic layer deposition SnOx infrared transparent conductive thin films
149Plasma-Assisted ALD of Highly Conductive HfNx: On the Effect of Energetic Ions on Film Microstructure
150Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
151Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
152Plasma-assisted atomic layer deposition of HfNx: Tailoring the film properties by the plasma gas composition
153Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
154Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
155Plasma-assisted atomic layer deposition of TiN/Al2O3 stacks for metal-oxide-semiconductor capacitor applications
156Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
157Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
158Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
159Plasma-enhanced atomic layer deposition of Co on metal surfaces
160Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
161Plasma-Enhanced Atomic Layer Deposition of Cobalt Using Cyclopentadienyl Isopropyl Acetamidinato-Cobalt as a Precursor
162Plasma-enhanced atomic layer deposition of Cu–Mn films with formation of a MnSixOy barrier layer
163Plasma-Enhanced Atomic Layer Deposition of Ni
164Plasma-Enhanced Atomic Layer Deposition of Nickel Nanotubes with Low Resistivity and Coherent Magnetization Dynamics for 3D Spintronics
165Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
166Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
167Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
168Plasma-Enhanced Atomic Layer Deposition of Semiconductor Grade ZnO Using Dimethyl Zinc
169Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films
170Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
171Plasma-enhanced atomic layer deposition of superconducting niobium nitride
172Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
173Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
174Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
175Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
176Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
177Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
178Plasma-enhanced atomic layer deposition of tantalum thin films: the growth and film properties
179Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
180Plasma-enhanced atomic layer deposition of titanium molybdenum nitride: Influence of RF bias and substrate structure
181Plasma-enhanced atomic layer deposition of titanium vanadium nitride
182Plasma-enhanced atomic layer deposition of tungsten nitride
183Plasma-enhanced atomic layer deposition of vanadium nitride
184Plasma-Modified Atomic Layer Deposition
185Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
186Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
187Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization
188Probing the Origin and Suppression of Vertically Oriented Nanostructures of 2D WS2 Layers
189Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
190Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
191Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
192Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
193Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
194Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
195Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
196Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
197Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
198Real-time growth study of plasma assisted atomic layer epitaxy of InN films by synchrotron x-ray methods
199Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
200Remote Plasma ALD of Platinum and Platinum Oxide Films
201Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films
202Remote Plasma Atomic Layer Deposition of Co3O4 Thin Film
203Remote Plasma Atomic Layer Deposition of Co3O4 Thin Films
204Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
205Remote plasma enhanced atomic layer deposition of ZnO for thin film electronic applications
206Remote plasma-enhanced atomic layer deposition of metallic TiN films with low work function and high uniformity
207Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
208Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
209Role of temperature on structure and electrical properties of titanium nitride films grown by low pressure plasma enhanced atomic layer deposition
210Room-Temperature Atomic Layer Deposition of Platinum
211Room-temperature field effect transistors with metallic ultrathin TiN-based channel prepared by atomic layer delta doping and deposition
212Ru thin film grown on TaN by plasma enhanced atomic layer deposition
213Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
214Selective Deposition of Low Temperature AlN Ohmic Contacts for GaN Devices
215Self Assembled Metamaterials Formed via Plasma Enhanced ALD of Ag Thin Films
216Self-limiting deposition of semiconducting ZnO by pulsed plasma-enhanced chemical vapor deposition
217Strongly Disordered TiN and NbTiN s-Wave Superconductors Probed by Microwave Electrodynamics
218Structural and electrical properties of ultrathin niobium nitride films grown by atomic layer deposition
219Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
220Structural, optical, electrical and resistive switching properties of ZnO thin films deposited by thermal and plasma-enhanced atomic layer deposition
221Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
222Structure-property relationship and interfacial phenomena in GaN grown on C-plane sapphire via plasma-enhanced atomic layer deposition
223Study on the characteristics of aluminum thin films prepared by atomic layer deposition
224Superconducting nanowire single-photon detectors fabricated from atomic-layer-deposited NbN
225Superconducting niobium nitride thin films deposited by metal organic plasma-enhanced atomic layer deposition
226Superconducting niobium titanium nitride thin films deposited by plasma-enhanced atomic layer deposition
227Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
228TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
229Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition
230Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
231Tetraallyltin precursor for plasma enhanced atomic layer deposition of tin oxide: Growth study and material characterization
232The effect of oxygen remote plasma treatment on ZnO TFTs fabricated by atomic layer deposition
233The Effects of UV Exposure on Plasma-Enhanced Atomic Layer Deposition ZnO Thin Film Transistor
234The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
235The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
236The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
237The Sandwich Structure of Ga-Doped ZnO Thin Films Grown via H2O-, O2-, and O3-Based Atomic Layer Deposition
238Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
239Thermal and Plasma-Enhanced Atomic Layer Deposition of TiN Using TDMAT and NH3 on Particles Agitated in a Rotary Reactor
240Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
241Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
242TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
243Titanium oxynitride films for surface passivation of crystalline silicon deposited by plasma-enhanced atomic layer deposition to improve electrical conductivity
244Tunable Electrical Properties of Vanadium Oxide by Hydrogen-Plasma-Treated Atomic Layer Deposition
245Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
246Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
247Tuning of undoped ZnO thin film via plasma enhanced atomic layer deposition and its application for an inverted polymer solar cell
248Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
249Ultrahigh purity conditions for nitride growth with low oxygen content by plasma-enhanced atomic layer deposition
250Ultrathin effective TiN protective films prepared by plasma-enhanced atomic layer deposition for high performance metallic bipolar plates of polymer electrolyte membrane fuel cells
251Ultraviolet Electroluminescence from Nitrogen-Doped ZnO-Based Heterojuntion Light-Emitting Diodes Prepared by Remote Plasma in situ Atomic Layer-Doping Technique
252Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon
253Wafer-level uniformity of atomic-layer-deposited niobium nitride thin films for quantum devices
254WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications
255ZnO Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition: Material Properties Within and Outside the "Atomic Layer Deposition Window"