Resistivity, Sheet Resistance Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Resistivity, Sheet Resistance returned 209 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
3A controlled growth of WNx and WCx thin films prepared by atomic layer deposition
4A route to low temperature growth of single crystal GaN on sapphire
5Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
6Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
7Analysis of NbN thin film deposition by plasma-enhanced ALD for gate electrode application
8Approximation of PE-MOCVD to ALD for TiN Concerning Resistivity and Chemical Composition
9Atmospheric pressure plasma enhanced spatial ALD of silver
10Atmospheric pressure plasma enhanced spatial atomic layer deposition of SnOx as conductive gas diffusion barrier
11Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
12Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
13Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
14Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
15Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
16Atomic layer deposition of high-mobility hydrogen-doped zinc oxide
17Atomic layer deposition of platinum with enhanced nucleation and coalescence by trimethylaluminum pre-pulsing
18Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
19Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
20Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
21Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
22Atomic layer deposition of titanium nitride for quantum circuits
23Atomic layer deposition of titanium nitride from TDMAT precursor
24Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
25Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
26Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
27Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
28Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
29Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
30Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
31Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
32Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
33Comparison of gate dielectric plasma damage from plasma-enhanced atomic layer deposited and magnetron sputtered TiN metal gates
34Comparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor
35Conformal Fe, Co and Ni Films from Oxides and Nitrides Grown by Atomic Layer Deposition
36Copper-ALD Seed Layer as an Enabler for Device Scaling
37Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
38Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
39Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
40Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
41Deposition of TiN and HfO2 in a commercial 200 mm remote plasma atomic layer deposition reactor
42Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
43Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
44Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
45Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
46Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
47Effect of in situ hydrogen plasma treatment on zinc oxide grown using low temperature atomic layer deposition
48Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
49Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
50Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
51Electrodynamic response and local tunneling spectroscopy of strongly disordered superconducting TiN films
52Electronic and optical device applications of hollow cathode plasma assisted atomic layer deposition based GaN thin films
53Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
54Energetic ions during plasma-enhanced atomic layer deposition and their role in tailoring material properties
55Energy transformation of plasmonic photocatalytic oxidation on 1D quantum well of platinum thin film
56Enhanced photocatalytic performance in atomic layer deposition grown TiO2 thin films via hydrogen plasma treatment
57Enhancement of the Electrical Properties of Ga-doped ZnO Thin Films on Polycarbonate Substrates by Using a TiO2 Buffer Layer
58Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxy
59Epitaxial Growth of Cubic and Hexagonal InN Thin Films via Plasma-Assisted Atomic Layer Epitaxy
60Evaluation of plasma parameters on PEALD deposited TaCN
61Fermi Level Tuning of ZnO Films Through Supercycled Atomic Layer Deposition
62Film Uniformity in Atomic Layer Deposition
63Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
64Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
65Forming-free resistive switching of tunable ZnO films grown by atomic layer deposition
66Fully CMOS-compatible titanium nitride nanoantennas
67GeSbTe deposition for the PRAM application
68Growth and characterization of III-N ternary thin films by plasma assisted atomic layer epitaxy at low temperatures
69Growth and Characterization of Metastable Hexagonal Nickel Thin Films via Plasma-Enhanced Atomic Layer Deposition
70Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
71Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
72Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
73High mobility polycrystalline indium oxide thin-film transistors by means of plasma-enhanced atomic layer deposition
74High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
75High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition
76Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
77Highly Tunable Electrical Properties in Undoped ZnO Grown by Plasma Enhanced Thermal-ALD
78Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
79Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
80Hydrogen plasma-enhanced atomic layer deposition of copper thin films
81Improved electrical performances of plasma-enhanced atomic layer deposited TaCxNy films by adopting Ar/H2 plasma
82Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
83Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
84Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
85Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
86In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
87In situ spectroscopic ellipsometry study on the growth of ultrathin TiN films by plasma-assisted atomic layer deposition
88In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
89In-system photoelectron spectroscopy study of tin oxide layers produced from tetrakis(dimethylamino)tin by plasma enhanced atomic layer deposition
90Influence of atomic layer deposition valve temperature on ZrN plasma enhanced atomic layer deposition growth
91Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
92Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
93Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
94Investigating the TiN film quality and growth behavior for plasma-enhanced atomic layer deposition using TiCl4 and N2/H2/Ar radicals
95Lateral conductivity of n-GaP/p-Si heterojunction with an inversion layer
96Low resistivity HfNx grown by plasma-assisted ALD with external rf substrate biasing
97Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
98Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
99Low temperature plasma enhanced atomic layer deposition of conducting zirconium nitride films using tetrakis (dimethylamido) zirconium and forming gas (5% H2 + 95% N2) plasma
100Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
101Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
102Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
103Low-Temperature Deposition of TiN by Plasma-Assisted Atomic Layer Deposition
104Low-Temperature Growth of Indium Oxide Thin Film by Plasma-Enhanced Atomic Layer Deposition Using Liquid Dimethyl(N-ethoxy-2,2-dimethylpropanamido)indium for High-Mobility Thin Film Transistor Application
105Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
106Low-Temperature Plasma-Assisted Atomic-Layer-Deposited SnO2 as an Electron Transport Layer in Planar Perovskite Solar Cells
107Low-temperature plasma-enhanced atomic layer deposition of tin oxide electron selective layers for highly efficient planar perovskite solar cells
108Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
109Microwave properties of superconducting atomic-layer deposited TiN films
110Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
111Nucleation mechanism during WS2 plasma enhanced atomic layer deposition on amorphous Al2O3 and sapphire substrates
112Obtaining low resistivity (~100 µΩ cm) TiN films by plasma enhanced atomic layer deposition using a metalorganic precursor
113Optimization of Plasma Enhanced Atomic Layer Deposition Processes for Oxides, Nitrides and Metals in the Oxford Instruments FlexAL Reactor
114PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
115PEALD of Copper using New Precursors for Next Generation of Interconnections
116Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
117Plasma enhanced atomic layer deposition of molybdenum carbide and nitride with bis(tert-butylimido)bis(dimethylamido) molybdenum
118Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
119Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases
120Plasma enhanced atomic layer deposition of ZnO with diethyl zinc and oxygen plasma: Effect of precursor decomposition
121Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
122Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
123Plasma-assisted atomic layer deposition of HfNx: Tailoring the film properties by the plasma gas composition
124Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
125Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
126Plasma-assisted atomic layer deposition of TiN/Al2O3 stacks for metal-oxide-semiconductor capacitor applications
127Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
128Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
129Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
130Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
131Plasma-Enhanced Atomic Layer Deposition of Cobalt Using Cyclopentadienyl Isopropyl Acetamidinato-Cobalt as a Precursor
132Plasma-Enhanced Atomic Layer Deposition of Ni
133Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
134Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
135Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
136Plasma-Enhanced Atomic Layer Deposition of Semiconductor Grade ZnO Using Dimethyl Zinc
137Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films
138Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
139Plasma-enhanced atomic layer deposition of superconducting niobium nitride
140Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
141Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
142Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
143Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
144Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
145Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
146Plasma-enhanced atomic layer deposition of tantalum thin films: the growth and film properties
147Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
148Plasma-enhanced atomic layer deposition of titanium vanadium nitride
149Plasma-enhanced atomic layer deposition of tungsten nitride
150Plasma-Modified Atomic Layer Deposition
151Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
152Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
153Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization
154Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
155Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
156Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
157Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
158Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
159Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
160Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
161Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
162Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
163Real-time growth study of plasma assisted atomic layer epitaxy of InN films by synchrotron x-ray methods
164Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
165Remote Plasma ALD of Platinum and Platinum Oxide Films
166Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films
167Remote Plasma Atomic Layer Deposition of Co3O4 Thin Film
168Remote Plasma Atomic Layer Deposition of Co3O4 Thin Films
169Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
170Remote plasma enhanced atomic layer deposition of ZnO for thin film electronic applications
171Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
172Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
173Room-Temperature Atomic Layer Deposition of Platinum
174Room-temperature field effect transistors with metallic ultrathin TiN-based channel prepared by atomic layer delta doping and deposition
175Ru thin film grown on TaN by plasma enhanced atomic layer deposition
176Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
177Selective Deposition of Low Temperature AlN Ohmic Contacts for GaN Devices
178Self Assembled Metamaterials Formed via Plasma Enhanced ALD of Ag Thin Films
179Self-limiting deposition of semiconducting ZnO by pulsed plasma-enhanced chemical vapor deposition
180Strongly Disordered TiN and NbTiN s-Wave Superconductors Probed by Microwave Electrodynamics
181Structural and electrical properties of ultrathin niobium nitride films grown by atomic layer deposition
182Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
183Structural, optical, electrical and resistive switching properties of ZnO thin films deposited by thermal and plasma-enhanced atomic layer deposition
184Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
185Structure-property relationship and interfacial phenomena in GaN grown on C-plane sapphire via plasma-enhanced atomic layer deposition
186Study on the characteristics of aluminum thin films prepared by atomic layer deposition
187Superconducting niobium nitride thin films deposited by metal organic plasma-enhanced atomic layer deposition
188Superconducting niobium titanium nitride thin films deposited by plasma-enhanced atomic layer deposition
189Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
190Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition
191The effect of oxygen remote plasma treatment on ZnO TFTs fabricated by atomic layer deposition
192The Effects of UV Exposure on Plasma-Enhanced Atomic Layer Deposition ZnO Thin Film Transistor
193The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
194The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
195The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
196The Sandwich Structure of Ga-Doped ZnO Thin Films Grown via H2O-, O2-, and O3-Based Atomic Layer Deposition
197Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
198Thermal and Plasma-Enhanced Atomic Layer Deposition of TiN Using TDMAT and NH3 on Particles Agitated in a Rotary Reactor
199Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
200Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
201TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
202Tunable Electrical Properties of Vanadium Oxide by Hydrogen-Plasma-Treated Atomic Layer Deposition
203Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
204Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
205Tuning of undoped ZnO thin film via plasma enhanced atomic layer deposition and its application for an inverted polymer solar cell
206Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
207Ultraviolet Electroluminescence from Nitrogen-Doped ZnO-Based Heterojuntion Light-Emitting Diodes Prepared by Remote Plasma in situ Atomic Layer-Doping Technique
208Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon
209WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications


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