Resistivity, Sheet Resistance Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Resistivity, Sheet Resistance returned 228 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
3A controlled growth of WNx and WCx thin films prepared by atomic layer deposition
4A route to low temperature growth of single crystal GaN on sapphire
5Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
6Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
7All-oxide thin-film transistors with channels of mixed InOx-ZnOy formed by plasma-enhanced atomic layer deposition process
8Analysis of NbN thin film deposition by plasma-enhanced ALD for gate electrode application
9Antiferromagnetism and p-type conductivity of nonstoichiometric nickel oxide thin films
10Approximation of PE-MOCVD to ALD for TiN Concerning Resistivity and Chemical Composition
11Atmospheric pressure plasma enhanced spatial ALD of silver
12Atmospheric pressure plasma enhanced spatial atomic layer deposition of SnOx as conductive gas diffusion barrier
13Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
14Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
15Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
16Atomic Layer Deposition of Cobalt Using H2-, N2-, and NH3-Based Plasmas: On the Role of the Co-reactant
17Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
18Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
19Atomic layer deposition of high-mobility hydrogen-doped zinc oxide
20Atomic layer deposition of platinum with enhanced nucleation and coalescence by trimethylaluminum pre-pulsing
21Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
22Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
23Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
24Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
25Atomic Layer Deposition of TiN/Al2O3/TiN Nanolaminates for Capacitor Applications
26Atomic layer deposition of titanium nitride for quantum circuits
27Atomic layer deposition of titanium nitride from TDMAT precursor
28Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
29Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
30Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
31Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
32Characteristics of ALD-GZO Films with Driven-in Zn and Zn/Mg Sources for the Applications to Optoelectronic Devices
33Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
34Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
35Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
36Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
37Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
38Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
39Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
40Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
41Comparison of gate dielectric plasma damage from plasma-enhanced atomic layer deposited and magnetron sputtered TiN metal gates
42Comparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor
43Conformal Fe, Co and Ni Films from Oxides and Nitrides Grown by Atomic Layer Deposition
44Copper-ALD Seed Layer as an Enabler for Device Scaling
45Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
46Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
47Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
48Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
49Deposition of TiN and HfO2 in a commercial 200 mm remote plasma atomic layer deposition reactor
50Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
51Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
52Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
53Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
54Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
55Effect of in situ hydrogen plasma treatment on zinc oxide grown using low temperature atomic layer deposition
56Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
57Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
58Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
59Electrodynamic response and local tunneling spectroscopy of strongly disordered superconducting TiN films
60Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
61Energetic ions during plasma-enhanced atomic layer deposition and their role in tailoring material properties
62Energy transformation of plasmonic photocatalytic oxidation on 1D quantum well of platinum thin film
63Enhanced photocatalytic performance in atomic layer deposition grown TiO2 thin films via hydrogen plasma treatment
64Enhancement of the Electrical Properties of Ga-doped ZnO Thin Films on Polycarbonate Substrates by Using a TiO2 Buffer Layer
65Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxy
66Epitaxial Growth of Cubic and Hexagonal InN Thin Films via Plasma-Assisted Atomic Layer Epitaxy
67Evaluation of plasma parameters on PEALD deposited TaCN
68Fermi Level Tuning of ZnO Films Through Supercycled Atomic Layer Deposition
69Film Uniformity in Atomic Layer Deposition
70Formation of Nano-Crystalline Ru-Based Ternary Thin Films by Plasma-Enhanced Atomic Layer Deposition
71Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
72Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
73Forming-free resistive switching of tunable ZnO films grown by atomic layer deposition
74Fully CMOS-compatible titanium nitride nanoantennas
75GeSbTe deposition for the PRAM application
76Growth and characterization of III-N ternary thin films by plasma assisted atomic layer epitaxy at low temperatures
77Growth and Characterization of Metastable Hexagonal Nickel Thin Films via Plasma-Enhanced Atomic Layer Deposition
78Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
79Growth of controllable ZnO film by atomic layer deposition technique via inductively coupled plasma treatment
80Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
81Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
82High mobility polycrystalline indium oxide thin-film transistors by means of plasma-enhanced atomic layer deposition
83High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
84High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
85High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition
86Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
87Highly Tunable Electrical Properties in Undoped ZnO Grown by Plasma Enhanced Thermal-ALD
88Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
89Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
90Hydrogen plasma-enhanced atomic layer deposition of copper thin films
91Improved electrical performances of plasma-enhanced atomic layer deposited TaCxNy films by adopting Ar/H2 plasma
92Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
93Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
94Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
95Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
96In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
97In situ spectroscopic ellipsometry study on the growth of ultrathin TiN films by plasma-assisted atomic layer deposition
98In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
99In-system photoelectron spectroscopy study of tin oxide layers produced from tetrakis(dimethylamino)tin by plasma enhanced atomic layer deposition
100Influence of atomic layer deposition valve temperature on ZrN plasma enhanced atomic layer deposition growth
101Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
102Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
103Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
104Investigating the TiN film quality and growth behavior for plasma-enhanced atomic layer deposition using TiCl4 and N2/H2/Ar radicals
105Lateral conductivity of n-GaP/p-Si heterojunction with an inversion layer
106Low resistivity HfNx grown by plasma-assisted ALD with external rf substrate biasing
107Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
108Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
109Low temperature plasma enhanced atomic layer deposition of conducting zirconium nitride films using tetrakis (dimethylamido) zirconium and forming gas (5% H2 + 95% N2) plasma
110Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
111Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
112Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
113Low-Temperature Deposition of TiN by Plasma-Assisted Atomic Layer Deposition
114Low-Temperature Growth of Indium Oxide Thin Film by Plasma-Enhanced Atomic Layer Deposition Using Liquid Dimethyl(N-ethoxy-2,2-dimethylpropanamido)indium for High-Mobility Thin Film Transistor Application
115Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
116Low-Temperature Plasma-Assisted Atomic-Layer-Deposited SnO2 as an Electron Transport Layer in Planar Perovskite Solar Cells
117Low-temperature plasma-enhanced atomic layer deposition of tin oxide electron selective layers for highly efficient planar perovskite solar cells
118Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
119Microwave properties of superconducting atomic-layer deposited TiN films
120Nanowire single-photon detectors made of atomic layer-deposited niobium nitride
121Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
122Nucleation mechanism during WS2 plasma enhanced atomic layer deposition on amorphous Al2O3 and sapphire substrates
123Obtaining low resistivity (~100 µΩ cm) TiN films by plasma enhanced atomic layer deposition using a metalorganic precursor
124Optimization of Plasma Enhanced Atomic Layer Deposition Processes for Oxides, Nitrides and Metals in the Oxford Instruments FlexAL Reactor
125PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
126PEALD of Copper using New Precursors for Next Generation of Interconnections
127Phase Control of Crystalline Ga2O3 Films by Plasma-Enhanced Atomic Layer Deposition
128Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
129Plasma enhanced atomic layer deposition of molybdenum carbide and nitride with bis(tert-butylimido)bis(dimethylamido) molybdenum
130Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
131Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
132Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
133Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases
134Plasma enhanced atomic layer deposition of ZnO with diethyl zinc and oxygen plasma: Effect of precursor decomposition
135Plasma-Assisted ALD of Highly Conductive HfNx: On the Effect of Energetic Ions on Film Microstructure
136Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
137Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
138Plasma-assisted atomic layer deposition of HfNx: Tailoring the film properties by the plasma gas composition
139Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
140Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
141Plasma-assisted atomic layer deposition of TiN/Al2O3 stacks for metal-oxide-semiconductor capacitor applications
142Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
143Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
144Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
145Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
146Plasma-Enhanced Atomic Layer Deposition of Cobalt Using Cyclopentadienyl Isopropyl Acetamidinato-Cobalt as a Precursor
147Plasma-Enhanced Atomic Layer Deposition of Ni
148Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
149Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
150Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
151Plasma-Enhanced Atomic Layer Deposition of Semiconductor Grade ZnO Using Dimethyl Zinc
152Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films
153Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
154Plasma-enhanced atomic layer deposition of superconducting niobium nitride
155Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
156Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
157Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
158Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
159Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
160Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
161Plasma-enhanced atomic layer deposition of tantalum thin films: the growth and film properties
162Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
163Plasma-enhanced atomic layer deposition of titanium vanadium nitride
164Plasma-enhanced atomic layer deposition of tungsten nitride
165Plasma-enhanced atomic layer deposition of vanadium nitride
166Plasma-Modified Atomic Layer Deposition
167Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
168Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
169Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization
170Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
171Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
172Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
173Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
174Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
175Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
176Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
177Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
178Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
179Real-time growth study of plasma assisted atomic layer epitaxy of InN films by synchrotron x-ray methods
180Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
181Remote Plasma ALD of Platinum and Platinum Oxide Films
182Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films
183Remote Plasma Atomic Layer Deposition of Co3O4 Thin Film
184Remote Plasma Atomic Layer Deposition of Co3O4 Thin Films
185Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
186Remote plasma enhanced atomic layer deposition of ZnO for thin film electronic applications
187Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
188Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
189Role of temperature on structure and electrical properties of titanium nitride films grown by low pressure plasma enhanced atomic layer deposition
190Room-Temperature Atomic Layer Deposition of Platinum
191Room-temperature field effect transistors with metallic ultrathin TiN-based channel prepared by atomic layer delta doping and deposition
192Ru thin film grown on TaN by plasma enhanced atomic layer deposition
193Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
194Selective Deposition of Low Temperature AlN Ohmic Contacts for GaN Devices
195Self Assembled Metamaterials Formed via Plasma Enhanced ALD of Ag Thin Films
196Self-limiting deposition of semiconducting ZnO by pulsed plasma-enhanced chemical vapor deposition
197Strongly Disordered TiN and NbTiN s-Wave Superconductors Probed by Microwave Electrodynamics
198Structural and electrical properties of ultrathin niobium nitride films grown by atomic layer deposition
199Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
200Structural, optical, electrical and resistive switching properties of ZnO thin films deposited by thermal and plasma-enhanced atomic layer deposition
201Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
202Structure-property relationship and interfacial phenomena in GaN grown on C-plane sapphire via plasma-enhanced atomic layer deposition
203Study on the characteristics of aluminum thin films prepared by atomic layer deposition
204Superconducting niobium nitride thin films deposited by metal organic plasma-enhanced atomic layer deposition
205Superconducting niobium titanium nitride thin films deposited by plasma-enhanced atomic layer deposition
206Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
207TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
208Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition
209The effect of oxygen remote plasma treatment on ZnO TFTs fabricated by atomic layer deposition
210The Effects of UV Exposure on Plasma-Enhanced Atomic Layer Deposition ZnO Thin Film Transistor
211The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
212The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
213The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
214The Sandwich Structure of Ga-Doped ZnO Thin Films Grown via H2O-, O2-, and O3-Based Atomic Layer Deposition
215Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
216Thermal and Plasma-Enhanced Atomic Layer Deposition of TiN Using TDMAT and NH3 on Particles Agitated in a Rotary Reactor
217Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
218Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
219TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
220Tunable Electrical Properties of Vanadium Oxide by Hydrogen-Plasma-Treated Atomic Layer Deposition
221Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
222Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
223Tuning of undoped ZnO thin film via plasma enhanced atomic layer deposition and its application for an inverted polymer solar cell
224Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
225Ultraviolet Electroluminescence from Nitrogen-Doped ZnO-Based Heterojuntion Light-Emitting Diodes Prepared by Remote Plasma in situ Atomic Layer-Doping Technique
226Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon
227WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications