Resistivity, Sheet Resistance Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Resistivity, Sheet Resistance returned 187 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
3A controlled growth of WNx and WCx thin films prepared by atomic layer deposition
4A route to low temperature growth of single crystal GaN on sapphire
5Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
6Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
7Analysis of NbN thin film deposition by plasma-enhanced ALD for gate electrode application
8Approximation of PE-MOCVD to ALD for TiN Concerning Resistivity and Chemical Composition
9Atmospheric pressure plasma enhanced spatial ALD of silver
10Atmospheric pressure plasma enhanced spatial atomic layer deposition of SnOx as conductive gas diffusion barrier
11Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
12Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
13Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
14Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
15Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
16Atomic layer deposition of high-mobility hydrogen-doped zinc oxide
17Atomic layer deposition of platinum with enhanced nucleation and coalescence by trimethylaluminum pre-pulsing
18Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
19Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
20Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
21Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
22Atomic layer deposition of titanium nitride for quantum circuits
23Atomic layer deposition of titanium nitride from TDMAT precursor
24Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
25Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
26Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
27Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
28Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
29Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
30Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
31Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
32Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
33Comparison of gate dielectric plasma damage from plasma-enhanced atomic layer deposited and magnetron sputtered TiN metal gates
34Comparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor
35Conformal Fe, Co and Ni Films from Oxides and Nitrides Grown by Atomic Layer Deposition
36Copper-ALD Seed Layer as an Enabler for Device Scaling
37Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
38Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
39Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
40Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
41Deposition of TiN and HfO2 in a commercial 200 mm remote plasma atomic layer deposition reactor
42Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
43Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
44Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
45Effect of in situ hydrogen plasma treatment on zinc oxide grown using low temperature atomic layer deposition
46Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
47Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
48Electrodynamic response and local tunneling spectroscopy of strongly disordered superconducting TiN films
49Electronic and optical device applications of hollow cathode plasma assisted atomic layer deposition based GaN thin films
50Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
51Energetic ions during plasma-enhanced atomic layer deposition and their role in tailoring material properties
52Energy transformation of plasmonic photocatalytic oxidation on 1D quantum well of platinum thin film
53Enhanced photocatalytic performance in atomic layer deposition grown TiO2 thin films via hydrogen plasma treatment
54Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxy
55Epitaxial Growth of Cubic and Hexagonal InN Thin Films via Plasma-Assisted Atomic Layer Epitaxy
56Evaluation of plasma parameters on PEALD deposited TaCN
57Fermi Level Tuning of ZnO Films Through Supercycled Atomic Layer Deposition
58Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
59Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
60Forming-free resistive switching of tunable ZnO films grown by atomic layer deposition
61Fully CMOS-compatible titanium nitride nanoantennas
62Growth and characterization of III-N ternary thin films by plasma assisted atomic layer epitaxy at low temperatures
63Growth and Characterization of Metastable Hexagonal Nickel Thin Films via Plasma-Enhanced Atomic Layer Deposition
64Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
65Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
66High mobility polycrystalline indium oxide thin-film transistors by means of plasma-enhanced atomic layer deposition
67High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
68High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition
69Highly Tunable Electrical Properties in Undoped ZnO Grown by Plasma Enhanced Thermal-ALD
70Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
71Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
72Hydrogen plasma-enhanced atomic layer deposition of copper thin films
73Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
74Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
75In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
76In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
77Influence of atomic layer deposition valve temperature on ZrN plasma enhanced atomic layer deposition growth
78Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
79Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
80Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
81Investigating the TiN film quality and growth behavior for plasma-enhanced atomic layer deposition using TiCl4 and N2/H2/Ar radicals
82Lateral conductivity of n-GaP/p-Si heterojunction with an inversion layer
83Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
84Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
85Low temperature plasma enhanced atomic layer deposition of conducting zirconium nitride films using tetrakis (dimethylamido) zirconium and forming gas (5% H2 + 95% N2) plasma
86Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
87Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
88Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
89Low-Temperature Growth of Indium Oxide Thin Film by Plasma-Enhanced Atomic Layer Deposition Using Liquid Dimethyl(N-ethoxy-2,2-dimethylpropanamido)indium for High-Mobility Thin Film Transistor Application
90Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
91Low-temperature plasma-enhanced atomic layer deposition of tin oxide electron selective layers for highly efficient planar perovskite solar cells
92Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
93Microwave properties of superconducting atomic-layer deposited TiN films
94Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
95Nucleation mechanism during WS2 plasma enhanced atomic layer deposition on amorphous Al2O3 and sapphire substrates
96Obtaining low resistivity (~100 µΩ cm) TiN films by plasma enhanced atomic layer deposition using a metalorganic precursor
97PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
98PEALD of Copper using New Precursors for Next Generation of Interconnections
99Plasma enhanced atomic layer deposition of molybdenum carbide and nitride with bis(tert-butylimido)bis(dimethylamido) molybdenum
100Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
101Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases
102Plasma enhanced atomic layer deposition of ZnO with diethyl zinc and oxygen plasma: Effect of precursor decomposition
103Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
104Plasma-assisted atomic layer deposition of HfNx: Tailoring the film properties by the plasma gas composition
105Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
106Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
107Plasma-assisted atomic layer deposition of TiN/Al2O3 stacks for metal-oxide-semiconductor capacitor applications
108Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
109Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
110Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
111Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
112Plasma-Enhanced Atomic Layer Deposition of Cobalt Using Cyclopentadienyl Isopropyl Acetamidinato-Cobalt as a Precursor
113Plasma-Enhanced Atomic Layer Deposition of Ni
114Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
115Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
116Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
117Plasma-Enhanced Atomic Layer Deposition of Semiconductor Grade ZnO Using Dimethyl Zinc
118Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films
119Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
120Plasma-enhanced atomic layer deposition of superconducting niobium nitride
121Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
122Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
123Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
124Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
125Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
126Plasma-enhanced atomic layer deposition of tantalum thin films: the growth and film properties
127Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
128Plasma-enhanced atomic layer deposition of titanium vanadium nitride
129Plasma-enhanced atomic layer deposition of tungsten nitride
130Plasma-Modified Atomic Layer Deposition
131Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
132Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
133Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization
134Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
135Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
136Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
137Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
138Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
139Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
140Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
141Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
142Real-time growth study of plasma assisted atomic layer epitaxy of InN films by synchrotron x-ray methods
143Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
144Remote Plasma ALD of Platinum and Platinum Oxide Films
145Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films
146Remote Plasma Atomic Layer Deposition of Co3O4 Thin Film
147Remote Plasma Atomic Layer Deposition of Co3O4 Thin Films
148Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
149Remote plasma enhanced atomic layer deposition of ZnO for thin film electronic applications
150Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
151Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
152Room-Temperature Atomic Layer Deposition of Platinum
153Room-temperature field effect transistors with metallic ultrathin TiN-based channel prepared by atomic layer delta doping and deposition
154Ru thin film grown on TaN by plasma enhanced atomic layer deposition
155Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
156Selective Deposition of Low Temperature AlN Ohmic Contacts for GaN Devices
157Self Assembled Metamaterials Formed via Plasma Enhanced ALD of Ag Thin Films
158Self-limiting deposition of semiconducting ZnO by pulsed plasma-enhanced chemical vapor deposition
159Strongly Disordered TiN and NbTiN s-Wave Superconductors Probed by Microwave Electrodynamics
160Structural and electrical properties of ultrathin niobium nitride films grown by atomic layer deposition
161Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
162Structural, optical, electrical and resistive switching properties of ZnO thin films deposited by thermal and plasma-enhanced atomic layer deposition
163Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
164Structure-property relationship and interfacial phenomena in GaN grown on C-plane sapphire via plasma-enhanced atomic layer deposition
165Study on the characteristics of aluminum thin films prepared by atomic layer deposition
166Superconducting niobium nitride thin films deposited by metal organic plasma-enhanced atomic layer deposition
167Superconducting niobium titanium nitride thin films deposited by plasma-enhanced atomic layer deposition
168Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition
169The effect of oxygen remote plasma treatment on ZnO TFTs fabricated by atomic layer deposition
170The Effects of UV Exposure on Plasma-Enhanced Atomic Layer Deposition ZnO Thin Film Transistor
171The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
172The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
173The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
174The Sandwich Structure of Ga-Doped ZnO Thin Films Grown via H2O-, O2-, and O3-Based Atomic Layer Deposition
175Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
176Thermal and Plasma-Enhanced Atomic Layer Deposition of TiN Using TDMAT and NH3 on Particles Agitated in a Rotary Reactor
177Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
178Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
179TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
180Tunable Electrical Properties of Vanadium Oxide by Hydrogen-Plasma-Treated Atomic Layer Deposition
181Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
182Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
183Tuning of undoped ZnO thin film via plasma enhanced atomic layer deposition and its application for an inverted polymer solar cell
184Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
185Ultraviolet Electroluminescence from Nitrogen-Doped ZnO-Based Heterojuntion Light-Emitting Diodes Prepared by Remote Plasma in situ Atomic Layer-Doping Technique
186Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon
187WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications


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