Resistivity, Sheet Resistance Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Resistivity, Sheet Resistance returned 236 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
3A controlled growth of WNx and WCx thin films prepared by atomic layer deposition
4A route to low temperature growth of single crystal GaN on sapphire
5Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM
6Ag films grown by remote plasma enhanced atomic layer deposition on different substrates
7All-oxide thin-film transistors with channels of mixed InOx-ZnOy formed by plasma-enhanced atomic layer deposition process
8Aluminum nitride thin films deposited by hydrogen plasma enhanced and thermal atomic layer deposition
9Analysis of NbN thin film deposition by plasma-enhanced ALD for gate electrode application
10Antiferromagnetism and p-type conductivity of nonstoichiometric nickel oxide thin films
11Approximation of PE-MOCVD to ALD for TiN Concerning Resistivity and Chemical Composition
12Atmospheric pressure plasma enhanced spatial ALD of silver
13Atmospheric pressure plasma enhanced spatial atomic layer deposition of SnOx as conductive gas diffusion barrier
14Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization
15Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
16Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
17Atomic Layer Deposition of Cobalt Using H2-, N2-, and NH3-Based Plasmas: On the Role of the Co-reactant
18Atomic Layer Deposition of Copper Seed Layers from a (hfac)Cu(VTMOS) Precursor
19Atomic layer deposition of copper thin film and feasibility of deposition on inner walls of waveguides
20Atomic layer deposition of high-mobility hydrogen-doped zinc oxide
21Atomic layer deposition of platinum with enhanced nucleation and coalescence by trimethylaluminum pre-pulsing
22Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
23Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
24Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
25Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
26Atomic Layer Deposition of TiN/Al2O3/TiN Nanolaminates for Capacitor Applications
27Atomic layer deposition of titanium nitride for quantum circuits
28Atomic layer deposition of titanium nitride from TDMAT precursor
29Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
30Baking and plasma pretreatment of sapphire surfaces as a way to facilitate the epitaxial plasma-enhanced atomic layer deposition of GaN thin films
31Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
32Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
33Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
34Characteristics of ALD-GZO Films with Driven-in Zn and Zn/Mg Sources for the Applications to Optoelectronic Devices
35Characteristics of HfN films deposited by using remote plasma-enhanced atomic layer deposition
36Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
37Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
38Characteristics of TiN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Method
39Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
40Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
41Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
42Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
43Comparison of gate dielectric plasma damage from plasma-enhanced atomic layer deposited and magnetron sputtered TiN metal gates
44Comparison of tungsten films grown by CVD and hot-wire assisted atomic layer deposition in a cold-wall reactor
45Conformal Fe, Co and Ni Films from Oxides and Nitrides Grown by Atomic Layer Deposition
46Copper-ALD Seed Layer as an Enabler for Device Scaling
47Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
48Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
49Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
50Deposition of copper by plasma-enhanced atomic layer deposition using a novel N-Heterocyclic carbene precursor
51Deposition of TiN and HfO2 in a commercial 200 mm remote plasma atomic layer deposition reactor
52Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
53Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
54Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
55Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
56Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
57Effect of in situ hydrogen plasma treatment on zinc oxide grown using low temperature atomic layer deposition
58Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
59Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
60Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
61Electrodynamic response and local tunneling spectroscopy of strongly disordered superconducting TiN films
62Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
63Energetic ions during plasma-enhanced atomic layer deposition and their role in tailoring material properties
64Energy transformation of plasmonic photocatalytic oxidation on 1D quantum well of platinum thin film
65Enhanced photocatalytic performance in atomic layer deposition grown TiO2 thin films via hydrogen plasma treatment
66Enhancement of the Electrical Properties of Ga-doped ZnO Thin Films on Polycarbonate Substrates by Using a TiO2 Buffer Layer
67Epitaxial growth of AlN films via plasma-assisted atomic layer epitaxy
68Epitaxial Growth of Cubic and Hexagonal InN Thin Films via Plasma-Assisted Atomic Layer Epitaxy
69Evaluation of plasma parameters on PEALD deposited TaCN
70Fermi Level Tuning of ZnO Films Through Supercycled Atomic Layer Deposition
71Film Uniformity in Atomic Layer Deposition
72Formation of Nano-Crystalline Ru-Based Ternary Thin Films by Plasma-Enhanced Atomic Layer Deposition
73Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
74Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
75Forming-free resistive switching of tunable ZnO films grown by atomic layer deposition
76Fully CMOS-compatible titanium nitride nanoantennas
77GeSbTe deposition for the PRAM application
78Growth and characterization of III-N ternary thin films by plasma assisted atomic layer epitaxy at low temperatures
79Growth and Characterization of Metastable Hexagonal Nickel Thin Films via Plasma-Enhanced Atomic Layer Deposition
80Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
81Growth of controllable ZnO film by atomic layer deposition technique via inductively coupled plasma treatment
82Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
83Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
84High mobility polycrystalline indium oxide thin-film transistors by means of plasma-enhanced atomic layer deposition
85High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
86High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
87High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition
88Highly Conductive HfNx Films Prepared by Plasma-Assisted Atomic Layer Deposition
89Highly Tunable Electrical Properties in Undoped ZnO Grown by Plasma Enhanced Thermal-ALD
90Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu
91Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
92Hydrogen plasma-enhanced atomic layer deposition of copper thin films
93Improved electrical performances of plasma-enhanced atomic layer deposited TaCxNy films by adopting Ar/H2 plasma
94Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
95Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
96Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
97Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
98In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
99In situ spectroscopic ellipsometry study on the growth of ultrathin TiN films by plasma-assisted atomic layer deposition
100In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
101In-system photoelectron spectroscopy study of tin oxide layers produced from tetrakis(dimethylamino)tin by plasma enhanced atomic layer deposition
102Influence of atomic layer deposition valve temperature on ZrN plasma enhanced atomic layer deposition growth
103Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
104Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
105Interface Properties of Nickel-silicide Films Deposited by Using Plasma-assisted Atomic Layer Deposition
106Investigating the TiN film quality and growth behavior for plasma-enhanced atomic layer deposition using TiCl4 and N2/H2/Ar radicals
107Lateral conductivity of n-GaP/p-Si heterojunction with an inversion layer
108Low resistivity HfNx grown by plasma-assisted ALD with external rf substrate biasing
109Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
110Low Temperature Atomic Layer Deposition of Crystalline In2O3 Films
111Low temperature plasma enhanced atomic layer deposition of conducting zirconium nitride films using tetrakis (dimethylamido) zirconium and forming gas (5% H2 + 95% N2) plasma
112Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
113Low Thermal Budget Heteroepitaxial Gallium Oxide Thin Films Enabled by Atomic Layer Deposition
114Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films
115Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
116Low-Temperature Deposition of TiN by Plasma-Assisted Atomic Layer Deposition
117Low-Temperature Growth of Indium Oxide Thin Film by Plasma-Enhanced Atomic Layer Deposition Using Liquid Dimethyl(N-ethoxy-2,2-dimethylpropanamido)indium for High-Mobility Thin Film Transistor Application
118Low-Temperature Low-Resistivity PEALD TiN Using TDMAT under Hydrogen Reducing Ambient
119Low-Temperature Plasma-Assisted Atomic-Layer-Deposited SnO2 as an Electron Transport Layer in Planar Perovskite Solar Cells
120Low-temperature plasma-enhanced atomic layer deposition of tin oxide electron selective layers for highly efficient planar perovskite solar cells
121Metallic Copper Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition of Air Stable Precursors
122Microwave properties of superconducting atomic-layer deposited TiN films
123Nanowire single-photon detectors made of atomic layer-deposited niobium nitride
124Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
125Nucleation mechanism during WS2 plasma enhanced atomic layer deposition on amorphous Al2O3 and sapphire substrates
126Obtaining low resistivity (~100 µΩ cm) TiN films by plasma enhanced atomic layer deposition using a metalorganic precursor
127Optimization of Plasma Enhanced Atomic Layer Deposition Processes for Oxides, Nitrides and Metals in the Oxford Instruments FlexAL Reactor
128PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
129PEALD of Copper using New Precursors for Next Generation of Interconnections
130Phase Control of Crystalline Ga2O3 Films by Plasma-Enhanced Atomic Layer Deposition
131Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
132Plasma enhanced atomic layer deposition of molybdenum carbide and nitride with bis(tert-butylimido)bis(dimethylamido) molybdenum
133Plasma Enhanced Atomic Layer Deposition of Ru-Ta composite film as a Seed Layer for CVD Cu filling
134Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
135Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
136Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases
137Plasma enhanced atomic layer deposition of ZnO with diethyl zinc and oxygen plasma: Effect of precursor decomposition
138Plasma-Assisted ALD of Highly Conductive HfNx: On the Effect of Energetic Ions on Film Microstructure
139Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
140Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
141Plasma-assisted atomic layer deposition of HfNx: Tailoring the film properties by the plasma gas composition
142Plasma-assisted atomic layer deposition of TiN films at low deposition temperature for high-aspect ratio applications
143Plasma-assisted atomic layer deposition of TiN monitored by in situ spectroscopic ellipsometry
144Plasma-assisted atomic layer deposition of TiN/Al2O3 stacks for metal-oxide-semiconductor capacitor applications
145Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
146Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
147Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
148Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
149Plasma-Enhanced Atomic Layer Deposition of Cobalt Using Cyclopentadienyl Isopropyl Acetamidinato-Cobalt as a Precursor
150Plasma-Enhanced Atomic Layer Deposition of Ni
151Plasma-Enhanced Atomic Layer Deposition of Nickel Nanotubes with Low Resistivity and Coherent Magnetization Dynamics for 3D Spintronics
152Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
153Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
154Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
155Plasma-Enhanced Atomic Layer Deposition of Semiconductor Grade ZnO Using Dimethyl Zinc
156Plasma-Enhanced Atomic Layer Deposition of Silver Thin Films
157Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
158Plasma-enhanced atomic layer deposition of superconducting niobium nitride
159Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
160Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
161Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
162Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
163Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
164Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
165Plasma-enhanced atomic layer deposition of tantalum thin films: the growth and film properties
166Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
167Plasma-enhanced atomic layer deposition of titanium vanadium nitride
168Plasma-enhanced atomic layer deposition of tungsten nitride
169Plasma-enhanced atomic layer deposition of vanadium nitride
170Plasma-Modified Atomic Layer Deposition
171Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures
172Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
173Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization
174Probing the Origin and Suppression of Vertically Oriented Nanostructures of 2D WS2 Layers
175Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
176Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization
177Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
178Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
179Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
180Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
181Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
182Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates
183Radical-Enhanced Atomic Layer Deposition of Silver Thin Films Using Phosphine-Adducted Silver Carboxylates - Thesis Coverage
184Real-time growth study of plasma assisted atomic layer epitaxy of InN films by synchrotron x-ray methods
185Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
186Remote Plasma ALD of Platinum and Platinum Oxide Films
187Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films
188Remote Plasma Atomic Layer Deposition of Co3O4 Thin Film
189Remote Plasma Atomic Layer Deposition of Co3O4 Thin Films
190Remote plasma enhanced atomic layer deposition of TiN thin films using metalorganic precursor
191Remote plasma enhanced atomic layer deposition of ZnO for thin film electronic applications
192Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
193Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
194Role of temperature on structure and electrical properties of titanium nitride films grown by low pressure plasma enhanced atomic layer deposition
195Room-Temperature Atomic Layer Deposition of Platinum
196Room-temperature field effect transistors with metallic ultrathin TiN-based channel prepared by atomic layer delta doping and deposition
197Ru thin film grown on TaN by plasma enhanced atomic layer deposition
198Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
199Selective Deposition of Low Temperature AlN Ohmic Contacts for GaN Devices
200Self Assembled Metamaterials Formed via Plasma Enhanced ALD of Ag Thin Films
201Self-limiting deposition of semiconducting ZnO by pulsed plasma-enhanced chemical vapor deposition
202Strongly Disordered TiN and NbTiN s-Wave Superconductors Probed by Microwave Electrodynamics
203Structural and electrical properties of ultrathin niobium nitride films grown by atomic layer deposition
204Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
205Structural, optical, electrical and resistive switching properties of ZnO thin films deposited by thermal and plasma-enhanced atomic layer deposition
206Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
207Structure-property relationship and interfacial phenomena in GaN grown on C-plane sapphire via plasma-enhanced atomic layer deposition
208Study on the characteristics of aluminum thin films prepared by atomic layer deposition
209Superconducting niobium nitride thin films deposited by metal organic plasma-enhanced atomic layer deposition
210Superconducting niobium titanium nitride thin films deposited by plasma-enhanced atomic layer deposition
211Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
212TaCN growth with PDMAT and H2/Ar plasma by plasma enhanced atomic layer deposition
213Temperature control for the gate workfunction engineering of TiC film by atomic layer deposition
214The effect of oxygen remote plasma treatment on ZnO TFTs fabricated by atomic layer deposition
215The Effects of UV Exposure on Plasma-Enhanced Atomic Layer Deposition ZnO Thin Film Transistor
216The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
217The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
218The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
219The Sandwich Structure of Ga-Doped ZnO Thin Films Grown via H2O-, O2-, and O3-Based Atomic Layer Deposition
220Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
221Thermal and Plasma-Enhanced Atomic Layer Deposition of TiN Using TDMAT and NH3 on Particles Agitated in a Rotary Reactor
222Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
223Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
224TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
225Titanium oxynitride films for surface passivation of crystalline silicon deposited by plasma-enhanced atomic layer deposition to improve electrical conductivity
226Tunable Electrical Properties of Vanadium Oxide by Hydrogen-Plasma-Treated Atomic Layer Deposition
227Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
228Tuning Material Properties of Oxides and Nitrides by Substrate Biasing during Plasma-Enhanced Atomic Layer Deposition on Planar and 3D Substrate Topographies
229Tuning of undoped ZnO thin film via plasma enhanced atomic layer deposition and its application for an inverted polymer solar cell
230Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
231Ultrathin effective TiN protective films prepared by plasma-enhanced atomic layer deposition for high performance metallic bipolar plates of polymer electrolyte membrane fuel cells
232Ultraviolet Electroluminescence from Nitrogen-Doped ZnO-Based Heterojuntion Light-Emitting Diodes Prepared by Remote Plasma in situ Atomic Layer-Doping Technique
233Use of B2O3 films grown by plasma-assisted atomic layer deposition for shallow boron doping in silicon
234WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications
235ZnO Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition: Material Properties Within and Outside the "Atomic Layer Deposition Window"