Publication Information

Title:
A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
Type:
Journal
Info:
Journal of The Electrochemical Society, 155 (8) H589-H594 (2008)
Date:
2008-05-20

Author Information

Name Institution
Soo-Hyun KimYeungnam University
Hyun Tae KimYeungnam University
Sung-Soo YimSeoul National University
Do-Joong LeeSeoul National University
Ki-Su KimSeoul National University
Hyun-Mi KimSeoul National University
Ki-Bum KimSeoul National University
Hyunchul SohnYonsei University

Films


Plasma Ru


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Substrates

Silicon
TaCN

Keywords

Diffusion Barrier

Notes

1162