Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorLink
1Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
2Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
3GelestDiethylruthenocene
4Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 30 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
3Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
4Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
5Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
6Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
7Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
8Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
9In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
10PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
11Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
12Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
13Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
14Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
15Ru thin film grown on TaN by plasma enhanced atomic layer deposition
16Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
17Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
18The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
19Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
20In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
21(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
22ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
23Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
24Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
25Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
26Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
27Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
28Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
29Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
30Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals


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