Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1Pegasus ChemicalsπŸ‡¬πŸ‡§Bis(ethylcyclopentadienyl)ruthenium
2GelestπŸ‡ΊπŸ‡ΈDiethylruthenocene
3Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
4DOCK/CHEMICALSπŸ‡©πŸ‡ͺBis(ethylcyclopentadienyl)ruthenium
5Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
6Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
7Yoodatech (Shanghai) Co., LtdBis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2 - contact maggie@yoodatech.com

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 42 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Texture of atomic layer deposited ruthenium
2Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
3Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
4Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
5Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
6Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
7Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
8Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
9Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
10Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
11Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
12Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
13PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
14Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
15The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
16Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
17Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
18Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
19Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
20In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
21Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
22Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
23(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
24Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
25Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
26Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
27Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
28Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
29Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
30Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
31In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
32Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
33Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
34Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
35Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
36Ru thin film grown on TaN by plasma enhanced atomic layer deposition
37Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
38Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
39ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
40Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
41Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
42A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu