Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1DOCK/CHEMICALSπŸ‡©πŸ‡ͺBis(ethylcyclopentadienyl)ruthenium
2Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
3GelestπŸ‡ΊπŸ‡ΈDiethylruthenocene
4Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
5Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
6Pegasus ChemicalsπŸ‡¬πŸ‡§Bis(ethylcyclopentadienyl)ruthenium

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 37 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
2Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
3PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
4Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
5Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
6Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
7Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
8Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
9Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
10Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
11Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
12Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
13ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
14A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
15Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
16Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
17Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
18Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
19The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
20Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
21Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
22Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
23Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
24(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
25Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
26Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
27Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
28Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
29Texture of atomic layer deposited ruthenium
30Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
31In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
32Ru thin film grown on TaN by plasma enhanced atomic layer deposition
33Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
34Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
35Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
36Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
37Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2