Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1Yoodatech (Shanghai) Co., LtdBis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2 - contact maggie@yoodatech.com
2DOCK/CHEMICALSπŸ‡©πŸ‡ͺBis(ethylcyclopentadienyl)ruthenium
3Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
4GelestπŸ‡ΊπŸ‡ΈDiethylruthenocene
5Pegasus ChemicalsπŸ‡¬πŸ‡§Bis(ethylcyclopentadienyl)ruthenium
6Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
7Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)

www.plasma-ald.com does not endorse any chemical suppliers. These links are provided for the benefit of our users. If a link goes bad, let us know.

If you would like your company's precursor products listed, or your existing listing changed or removed, send me an email.


Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 42 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
2Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
3In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
4Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
5Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
6Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
7The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
8Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
9Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
10Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
11Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
12Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
13Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
14Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
15Texture of atomic layer deposited ruthenium
16Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
17Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
18Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
19Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
20Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
21Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
22Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
23Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
24ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
25Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
26Ru thin film grown on TaN by plasma enhanced atomic layer deposition
27Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
28Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
29Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
30Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
31Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
32Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
33Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
34In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
35Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
36Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
37(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
38PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
39Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
40Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
41Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
42A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu