Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1DOCK/CHEMICALSπŸ‡©πŸ‡ͺBis(ethylcyclopentadienyl)ruthenium(II)
2Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
3GelestπŸ‡ΊπŸ‡ΈDiethylruthenocene
4Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
5Strem Chemicals, Inc.πŸ‡ΊπŸ‡ΈBis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 37 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
3Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
4Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
5Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
6Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
7Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
8Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
9In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
10Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
11Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
12PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
13Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
14Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
15Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
16Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
17Ru thin film grown on TaN by plasma enhanced atomic layer deposition
18Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
19Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
20Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
21Texture of atomic layer deposited ruthenium
22The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
23Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
24Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
25In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
26(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
27ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
28Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
29Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
30Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
31Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
32Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
33Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
34Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
35Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
36Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
37Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals