Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1Pegasus Chemicals🇬🇧Bis(ethylcyclopentadienyl)ruthenium
2Strem Chemicals, Inc.🇺🇸Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
3DOCK/CHEMICALS🇩🇪Bis(ethylcyclopentadienyl)ruthenium
4Strem Chemicals, Inc.🇺🇸Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD
5Strem Chemicals, Inc.🇺🇸Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
6Yoodatech (Shanghai) Co., LtdBis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2 - contact maggie@yoodatech.com
7Gelest🇺🇸Diethylruthenocene

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 42 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
2Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
3Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
4Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
5The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
6Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
7Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
8Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
9Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
10Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
11Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
12Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
13Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
14Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
15Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
16Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
17A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
18Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
19Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
20Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
21Ru thin film grown on TaN by plasma enhanced atomic layer deposition
22(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
23In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
24Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
25PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
26Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
27Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
28Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
29Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
30Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
31Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
32Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
33In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
34Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
35Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
36Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
37Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
38Texture of atomic layer deposited ruthenium
39Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
40Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
41ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
42Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2