Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorRegionLink
1Yoodatech (Shanghai) Co., LtdBis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2 - contact maggie@yoodatech.com
2Gelest🇺🇸Diethylruthenocene
3Strem Chemicals, Inc.🇺🇸Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
4Strem Chemicals, Inc.🇺🇸Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
5DOCK/CHEMICALS🇩🇪Bis(ethylcyclopentadienyl)ruthenium
6Pegasus Chemicals🇬🇧Bis(ethylcyclopentadienyl)ruthenium
7Strem Chemicals, Inc.🇺🇸Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 42 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
2Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
3PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
4Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
5Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
6Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
7Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
8Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
9Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
10Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
11Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
12Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
13Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
14Texture of atomic layer deposited ruthenium
15Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
16In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
17Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
18The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
19Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
20Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
21Ru thin film grown on TaN by plasma enhanced atomic layer deposition
22Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
23Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
24In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
25Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
26Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
27Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
28Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
29Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
30Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
31Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
32ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
33Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
34Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
35A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
36Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
37Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
38Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
39Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
40Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
41Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
42Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals