Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)₂, CAS# 32992-96-4

Where to buy

Number	Vendor	Link
1	Strem Chemicals, Inc.	Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
2	Strem Chemicals, Inc.	Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
3	Strem Chemicals, Inc.	Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 28 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2	Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
3	Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
4	Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
5	Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
6	Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
7	Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
8	In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
9	PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
10	Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
11	Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
12	Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
13	Ru thin film grown on TaN by plasma enhanced atomic layer deposition
14	Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
15	Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
16	The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
17	Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
18	In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
19	(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
20	ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
21	Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
22	Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
23	Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
24	Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
25	Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
26	Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
27	Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
28	Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals

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