Bis(EthylCycloPentadienyl)Ruthenium, Ru(EtCp)2, CAS# 32992-96-4

Where to buy

NumberVendorLink
1Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru)
2GelestDiethylruthenocene
3Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder for CVD/ALD
4Strem Chemicals, Inc.Bis(ethylcyclopentadienyl)ruthenium(II), 98% (99.9%-Ru), contained in 50 ml cylinder with high temperature valve for CVD/ALD

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 33 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
3Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
4Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
5Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
6Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
7Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
8Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
9In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
10Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
11PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
12Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
13Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
14Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
15Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
16Ru thin film grown on TaN by plasma enhanced atomic layer deposition
17Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
18Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
19The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
20Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
21Comparison of PVD, PECVD & PEALD Ru(-C) films as Cu diffusion barriers by means of bias temperature stress measurements
22In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
23(Invited) Characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 Capacitors
24ALD ruthenium oxide-carbon nanotube electrodes for supercapacitor applications
25Atomic layer deposition of RuO2 thin films on SiO2 using Ru(EtCp)2 and O2 plasma
26Effect of annealing conditions on formation of SrRuO3 films by interfacial reaction of SrO/RuO2 bi-layer films
27Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
28Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
29Ru Thin Film Formation Using Oxygen Plasma Enhanced ALD and Rapid Thermal Processing
30Solid Electrolyte Lithium Phosphous Oxynitride as a Protective Nanocladding Layer for 3D High-Capacity Conversion Electrodes
31Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
32Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
33Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals