Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 12(2) G5-G8 (2009)
Date:
2008-11-14
Author Information
Name | Institution |
---|---|
Ji-Hoon Ahn | Korea Advanced Institute of Science and Technology |
Ja-Yong Kim | Hynix Semiconductor |
Jin-Hyock Kim | Hynix Semiconductor |
Jae-Sung Roh | Hynix Semiconductor |
Sang-Won Kang | Korea Advanced Institute of Science and Technology |
Films
Film/Plasma Properties
Characteristic: Thermal Stability
Analysis: Anneal
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
Ru |
SiO2 |
Notes
800C O2 anneal of RuO2 etched the film. |
77 |