Sang-Won Kang Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Sang-Won Kang returned 27 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Controlling the composition of Ti1-xAlxN thin films by modifying the number of TiN and AlN subcycles in atomic layer deposition
2Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
3Antioxidation properties of Ti0.83Al0.17N prepared using plasma-enhanced atomic layer deposition
4Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
5Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
6Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
7Effect of Sr-Ruthenate Seed Layer on Dielectric Properties of SrTiO3 Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
8Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
9Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
10Increment of dielectric properties of SrTiO3 thin films by SrO interlayer on Ru bottom electrodes
11Study on the characteristics of aluminum thin films prepared by atomic layer deposition
12Interfacial Layer Properties of HfO2 Films Formed by Plasma-Enhanced Atomic Layer Deposition on Silicon
13Atomic Layer Deposition of Nickel by the Reduction of Preformed Nickel Oxide
14Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
15Enhanced Dielectric Properties of SrTiO3 Films with a SrRuO3 Seed by Plasma-Enhanced Atomic Layer Deposition
16Growth mechanism and diffusion barrier property of plasma-enhanced atomic layer deposition Ti-Si-N thin films
17Plasma-Enhanced ALD of Titanium-Silicon-Nitride Using TiCl4 , SiH4, and N2/H2/Ar Plasma
18Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
19PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
20Growth of aluminum nitride thin films prepared by plasma-enhanced atomic layer deposition
21Interface effect on dielectric constant of HfO2/Al2O3 nanolaminate films deposited by plasma-enhanced atomic layer deposition
22Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
23Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
24A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
25Increment of the Dielectric Constant of Ta2O5 Thin Films by Retarding Interface Oxide Growth on Si Substrates
26Enhancement of the TiO2 Thin-Film Dielectric Constant Through Pretreatment of Ir Substrate
27TiO2/Al2O3/TiO2 Nanolaminated Thin Films for DRAM Capacitor Deposited by Plasma-Enhanced Atomic Layer Deposition