TiO2/Al2O3/TiO2 Nanolaminated Thin Films for DRAM Capacitor Deposited by Plasma-Enhanced Atomic Layer Deposition

Type:
Journal
Info:
Electrochemical and Solid-State Letters, 11 2 H19-H21 2008
Date:
2007-11-26

Author Information

Name Institution
Woojin JeonKorea Advanced Institute of Science and Technology
Hoi-Sung ChungKorea Advanced Institute of Science and Technology
Daekwon JooKorea Advanced Institute of Science and Technology
Sang-Won KangKorea Advanced Institute of Science and Technology

Films

Plasma TiO2


Plasma Al2O3


Plasma Ir


Film/Plasma Properties

Characteristic: Dielectric Constant, Permittivity
Analysis: CV, Cyclic Voltammetry

Characteristic: EOT, Equivalent Oxide Thickness
Analysis: CV, Cyclic Voltammetry

Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Thickness
Analysis: -

Substrates

Ir
Silicon

Notes

RTA on some TiO2-Al2O3 films.
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