Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 5(10) C91-C93 (2002)
Date:
2002-08-06
Author Information
| Name | Institution |
|---|---|
| Yong Ju Lee | Korea Advanced Institute of Science and Technology |
| Sang-Won Kang | Korea Advanced Institute of Science and Technology |
Films
Plasma Al
Film/Plasma Properties
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Thickness
Analysis: Profilometry
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Substrates
| TiN |
Notes
| Thermal decomposition of TMA data |
| 5 |