Publication Information

Title:
Atomic layer deposition of aluminum thin films using an alternating supply of trimethylaluminum and a hydrogen plasma
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 5(10) C91-C93 (2002)
Date:
2002-08-06

Author Information

Name Institution
Yong Ju LeeKorea Advanced Institute of Science and Technology
Sang-Won KangKorea Advanced Institute of Science and Technology

Films


Film/Plasma Properties

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis

Characteristic: Thickness
Analysis: Profilometry

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Substrates

TiN

Keywords

PEALD Film Development

Notes

Thermal decomposition of TMA data
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