Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 7 (4) C46-C48 (2004)
Date:
2003-09-23
Author Information
| Name | Institution |
|---|---|
| Oh-Kyum Kwon | Korea Advanced Institute of Science and Technology |
| Se-Hun Kwon | Korea Advanced Institute of Science and Technology |
| Hyoung-Sang Park | Korea Advanced Institute of Science and Technology |
| Sang-Won Kang | Korea Advanced Institute of Science and Technology |
Films
Plasma Ru
Film/Plasma Properties
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Substrates
| TiN |
Notes
| 1238 |