Se-Hun Kwon Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Se-Hun Kwon returned 14 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode
2Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
3Titanium oxynitride films for surface passivation of crystalline silicon deposited by plasma-enhanced atomic layer deposition to improve electrical conductivity
4Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
5Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
6Ultrathin effective TiN protective films prepared by plasma-enhanced atomic layer deposition for high performance metallic bipolar plates of polymer electrolyte membrane fuel cells
7Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
8Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
9Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
10Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
11Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
12Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
13Growth of rutile-TiO2 thin films via Sn doping and insertion of ultra-thin SnO2 interlayer by atomic layer deposition
14PEALD of a Ruthenium Adhesion Layer for Copper Interconnects