Se-Hun Kwon Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Se-Hun Kwon returned 15 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
2Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
3Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
4Growth of rutile-TiO2 thin films via Sn doping and insertion of ultra-thin SnO2 interlayer by atomic layer deposition
5Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
6Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
7Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
8Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
9Titanium oxynitride films for surface passivation of crystalline silicon deposited by plasma-enhanced atomic layer deposition to improve electrical conductivity
10Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
11Ultrathin effective TiN protective films prepared by plasma-enhanced atomic layer deposition for high performance metallic bipolar plates of polymer electrolyte membrane fuel cells
12Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
13Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
14Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode
15PEALD of a Ruthenium Adhesion Layer for Copper Interconnects