Se-Hun Kwon Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Se-Hun Kwon returned 14 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

1Growth of rutile-TiO2 thin films via Sn doping and insertion of ultra-thin SnO2 interlayer by atomic layer deposition
2Ultrathin effective TiN protective films prepared by plasma-enhanced atomic layer deposition for high performance metallic bipolar plates of polymer electrolyte membrane fuel cells
3Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
4Sub-0.5 nm Equivalent Oxide Thickness Scaling for Si-Doped Zr1-xHfxO2 Thin Film without Using Noble Metal Electrode
5Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
6Titanium oxynitride films for surface passivation of crystalline silicon deposited by plasma-enhanced atomic layer deposition to improve electrical conductivity
7Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
8Plasma-enhanced atomic layer deposition of SnO2 thin films using SnCl4 and O2 plasma
9Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
10Electrical and Corrosion Properties of Titanium Aluminum Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
11Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
12Improved Oxygen Diffusion Barrier Properties of Ruthenium-Titanium Nitride Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition
13Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
14PEALD of a Ruthenium Adhesion Layer for Copper Interconnects