Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 37 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
3Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
4Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
5Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
6Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
7Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
8Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
9Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
10Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
11Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
12Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
13Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
14High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
15Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
16Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
17In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
18In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
19Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
20Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
21Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
22Non-destructive acoustic metrology and void detection in 3x50μm TSV
23PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
24Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
25Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
26Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
27Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
28Radical Enhanced Atomic Layer Deposition of Metals and Oxides
29Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
30Ru thin film grown on TaN by plasma enhanced atomic layer deposition
31Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
32Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
33Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
34The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
35The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
36Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
37Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition


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