Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 41 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
2Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
3Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
4Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
5Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
6Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
7Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
8Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
9Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
10Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
11Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
12Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
13Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
14Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
15Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
16High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
17Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
18Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
19In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
20In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
21Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
22Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
23Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
24Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
25Non-destructive acoustic metrology and void detection in 3x50μm TSV
26PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
27Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
28Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
29Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
30Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
31Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
32Radical Enhanced Atomic Layer Deposition of Metals and Oxides
33Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
34Ru thin film grown on TaN by plasma enhanced atomic layer deposition
35Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
36Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
37Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
38The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
39The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
40Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
41Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition


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