Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 49 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
2Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
3Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
4Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
5Non-destructive acoustic metrology and void detection in 3x50μm TSV
6Reactions of ruthenium cyclopentadienyl precursor in the metal precursor pulse of Ru atomic layer deposition
7Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
8Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
9Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
10Ru thin film grown on TaN by plasma enhanced atomic layer deposition
11Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
12Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
13Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
14In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
15Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
16Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
17Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
18A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
19High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
20Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
21Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
22The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
23Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
24Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
25Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
26Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
27Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
28Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
29Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
30Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
31Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
32In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
33Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
34Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
35Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
36Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
37Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
38Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
39Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
40Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
41Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
42Texture of atomic layer deposited ruthenium
43Radical Enhanced Atomic Layer Deposition of Metals and Oxides
44The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
45Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
46Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
47Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
48PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
49Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma