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Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 49 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
2Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
3Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
4Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
5Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
6Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
7Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
8Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
9Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
10The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
11Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
12Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
13Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
14Ru thin film grown on TaN by plasma enhanced atomic layer deposition
15Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
16Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
17Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
18Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
19Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
20PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
21Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
22Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
23In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
24Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
25Texture of atomic layer deposited ruthenium
26High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
27Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
28In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
29The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
30Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
31Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
32Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
33Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
34Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
35Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
36Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
37Radical Enhanced Atomic Layer Deposition of Metals and Oxides
38Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
39Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
40Non-destructive acoustic metrology and void detection in 3x50μm TSV
41Reactions of ruthenium cyclopentadienyl precursor in the metal precursor pulse of Ru atomic layer deposition
42Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
43Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
44Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
45Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
46Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
47Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
48A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
49Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects