Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 32 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

Number	Title
1	Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
2	Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
3	Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
4	Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
5	Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
6	Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
7	Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
8	Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
9	Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
10	Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
11	Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
12	Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
13	In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
14	In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
15	Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
16	Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
17	Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
18	Non-destructive acoustic metrology and void detection in 3x50μm TSV
19	PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
20	Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
21	Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
22	Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
23	Radical Enhanced Atomic Layer Deposition of Metals and Oxides
24	Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
25	Ru thin film grown on TaN by plasma enhanced atomic layer deposition
26	Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
27	Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
28	Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
29	The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
30	The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
31	Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
32	Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition

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I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. If you know of publications I have missed or a database entry is wrong, send me an email at: marksowa@plasma-ald.com

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