Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 49 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
2Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
3A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
4Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
5Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
6Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
7Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
8Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
9Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
10Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
11Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
12Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
13The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
14Non-destructive acoustic metrology and void detection in 3x50μm TSV
15Ru thin film grown on TaN by plasma enhanced atomic layer deposition
16Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
17Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
18Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition
19Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
20Reactions of ruthenium cyclopentadienyl precursor in the metal precursor pulse of Ru atomic layer deposition
21In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
22Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
23In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
24Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
25Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
26Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
27Properties of plasma enhanced atomic layer deposited ruthenium thin films from Ru(EtCp)2
28Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
29Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
30Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
31Texture of atomic layer deposited ruthenium
32Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
33The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
34Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
35Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
36Temperature controlled Ru and RuO2 growth via O* radical-enhanced atomic layer deposition with Ru(EtCp)2
37High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
38Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
39Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
40Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
41Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
42PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
43Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
44Radical Enhanced Atomic Layer Deposition of Metals and Oxides
45Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
46Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
47Initial and steady-state Ru growth by atomic layer deposition studied by in situ Angle Resolved X-ray Photoelectron Spectroscopy
48Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
49Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application