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Ru Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing Ru films returned 32 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
2Atomic layer deposition of Ru from CpRu(CO)2Et using O2 gas and O2 plasma
3Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
4Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
5Atomic Layer Deposition of Ruthenium and Ruthenium-oxide Thin Films by Using a Ru(EtCp)2 Precursor and Oxygen Gas
6Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
7Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
8Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
9Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
10Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
11Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
12Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
13In situ spectroscopic ellipsometry during atomic layer deposition of Pt, Ru and Pd
14In Situ Two-Step Plasma Enhanced Atomic Layer Deposition of Ru/RuNx Barriers for Seedless Copper Electroplating
15Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
16Mobile setup for synchrotron based in situ characterization during thermal and plasma-enhanced atomic layer deposition
17Near room temperature plasma enhanced atomic layer deposition of ruthenium using the RuO4-precursor and H2-plasma
18Non-destructive acoustic metrology and void detection in 3x50μm TSV
19PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
20Plasma-Enhanced Atomic Layer Deposition of Ru-TiN Thin Films for Copper Diffusion Barrier Metals
21Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
22Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
23Radical Enhanced Atomic Layer Deposition of Metals and Oxides
24Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
25Ru thin film grown on TaN by plasma enhanced atomic layer deposition
26Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
27Structural investigation of Ru/Pt nanocomposite films prepared by plasma-enhanced atomic layer depositions
28Structure of Ru/Pt Nanocomposite Films Fabricated by Plasma-Enhanced Atomic Layer Depositions
29The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
30The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
31Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
32Understanding the EOT-Jg degradation in Ru/SrTiOx/Ru metal-insulator-metal capacitors formed with Ru atomic layer deposition

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I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. If you know of publications I have missed or a database entry is wrong, send me an email at: marksowa@plasma-ald.com

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