Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
Type:
Journal
Info:
J. Vac. Sci. Technol. B 27(2)., Mar/Apr 2009
Date:
2009-03-20
Author Information
| Name | Institution |
|---|---|
| Daniel V. Greenslit | State University of New York at Albany |
| Tonmoy Chakraborty | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Plasma Ru-WCN
Plasma Ru
Plasma WCN
Film/Plasma Properties
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Barrier Characteristics
Analysis: TVS, Triangle Voltage Sweep
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Substrates
| SiO2 |
Notes
| 115 |