Eric T. Eisenbraun Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Eric T. Eisenbraun returned 16 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
2Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
3Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
4Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
5Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
6Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
7Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
8The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
9Copper-ALD Seed Layer as an Enabler for Device Scaling
10Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
11Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
12Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
13Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
14Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
15PEALD of Copper using New Precursors for Next Generation of Interconnections
16Hydrogen plasma-enhanced atomic layer deposition of copper thin films