Eric T. Eisenbraun Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications authored by Eric T. Eisenbraun returned 16 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
2Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
3Copper-ALD Seed Layer as an Enabler for Device Scaling
4Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
5Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
6Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
7Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
8Hydrogen plasma-enhanced atomic layer deposition of copper thin films
9Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
10Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
11Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
12Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
13PEALD of Copper using New Precursors for Next Generation of Interconnections
14Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications
15The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
16Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD