PEALD of Copper using New Precursors for Next Generation of Interconnections
Type:
Journal
Info:
ALD 2010 Poster
Date:
2010-06-20
Author Information
| Name | Institution |
|---|---|
| Jiajun Mao | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
| Vincent Omarjee | Air Liquide |
| Andrey Korolev | Air Liquide |
| Clement Lansalot-Matras | Air Liquide |
| Christian Dussarrat | Air Liquide |
Films
Plasma Cu
Plasma Cu
Film/Plasma Properties
Characteristic: Precursor Characterization
Analysis: TGA, Thermo Gravimetric Analysis
Characteristic: Precursor Characterization
Analysis: Vapor Pressure
Characteristic: Precursor Characterization
Analysis: Melting Point
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| Ru |
| SiO2 |
| TaN |
Notes
| Precursor data. |
| 700 |