Cuprum, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 2 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1PEALD of Copper using New Precursors for Next Generation of Interconnections
2Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD


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