Cuprum, CAS# 0-0-0
Plasma Enhanced Atomic Layer Deposition Film Publications
Your search for publications using this chemistry returned 2 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.
|1||PEALD of Copper using New Precursors for Next Generation of Interconnections|
|2||Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD|