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Publication Information

Title: Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD

Type: Conference Proceedings

Info: ECS Transactions, 33 (12) 125-135 (2010)

Date: 2010-07-08

DOI: http://dx.doi.org/10.1149/1.3501039

Author Information

Name

Institution

State University of New York at Albany

State University of New York at Albany

Air Liquide

Air Liquide

Air Liquide

Air Liquide

Films

Deposition Temperature Range = 85-100C

0-0-0

1333-74-0

Deposition Temperature Range = 60-100C

0-0-0

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Precursor Characterization

TGA, Thermo Gravimetric Analysis

Unknown

Thickness

SEM, Scanning Electron Microscopy

Carl-Zeiss LEO 1550

Thickness

RBS, Rutherford Backscattering Spectrometry

Unknown

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

Perkin Elmer 660

Resistivity, Sheet Resistance

Four-point Probe

Signatone QuadPro S-A8

Substrates

SiO2

Keywords

Interconnect

Metallic Thin Films

Notes

719


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