Publication Information

Title:
Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD
Type:
Conference Proceedings
Info:
ECS Transactions, 33 (12) 125-135 (2010)
Date:
2010-07-08

Author Information

Name Institution
Jiajun MaoState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany
Vincent OmarjeeAir Liquide
Andrey KorolevAir Liquide
Clement Lansalot-MatrasAir Liquide
Christian DussarratAir Liquide

Films

Plasma Cu


Plasma Cu


Film/Plasma Properties

Characteristic: Precursor Characterization
Analysis: TGA, Thermo Gravimetric Analysis

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

SiO2

Keywords

Interconnect
Metallic Thin Films

Notes

719