Your search for plasma enhanced atomic layer deposition publications using TEL Phoenix CVD cluster tool hardware returned 6 records. If there are too many results, you may want to use the multi-factor search to narrow the results.
|1||Copper-ALD Seed Layer as an Enabler for Device Scaling|
|2||Hydrogen plasma-enhanced atomic layer deposition of copper thin films|
|3||Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications|
|4||Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers|
|5||The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications|
|6||Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD|
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