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Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 11 (5) H107-H110 (2008)
Date:
2008-01-08
Author Information
| Name | Institution |
|---|---|
| Liqi Wu | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
Films
Plasma Cu
Film/Plasma Properties
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Continuity
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Continuity
Analysis: TEM, Transmission Electron Microscope
Characteristic: Chemical Composition, Impurities
Analysis: NRA, Nuclear Reaction Analysis
Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: XRD, X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| SiO2 |
| Ru |
Notes
| 1337 |