Publication Information

Title:
Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 11 (5) H107-H110 (2008)
Date:
2008-01-08

Author Information

Name Institution
Liqi WuState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Continuity
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Continuity
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: NRA, Nuclear Reaction Analysis

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: XRD, X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

SiO2
Ru

Keywords

Notes

1337