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An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
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copper(II) acetylacetonate, bis(2,4-pentanedionato) copper(II), cupric acetylacetonate, Cu(acac)2, CAS# 13395-16-9

Informational Websites

NumberWebsite
1http://webbook.nist.gov/cgi/cbook.cgi?ID=13395169&Units=SI

Where to buy

NumberVendorRegionLink
1TCI🇺🇸Bis(2,4-pentanedionato)copper(II)
2Alfa Aesar🇺🇸Copper(II) 2,4-pentanedionate, 98%
3Santa Cruz Biotechnology🇺🇸Copper(II) acetylacetonate
4Gelest🇺🇸Copper(II) 2,4-Pentanedionate
5Sigma-Aldrich, Co. LLC🇺🇸Copper(II) acetylacetonate <99.9% trace metals basis
6Ereztech🇺🇸Copper(II) acetylacetonate
7Strem Chemicals, Inc.🇺🇸Copper(II) acetylacetonate, 98+%
8Pegasus Chemicals🇬🇧Copper(II) Acetylacetonate

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 6 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Hydrogen plasma-enhanced atomic layer deposition of copper thin films
2Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films - Thesis Coverage
3Integration of Electrochemically Deposited Cu with Plasma Enhanced Atomic Layer Deposition-Grown Cu Seed Layers
4Effects of Hydrogen Plasma Treatments on the Atomic Layer Deposition of Copper
5Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
6Radical Enhanced Atomic Layer Deposition of Metals and Oxides