Publication Information

Title:
The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
Type:
Conference Proceedings
Info:
Mat. Res. Soc. Symp. Proc. Vol. 766 E10.4.1
Date:
2003-01-01

Author Information

Name Institution
Degang ChengState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films



Film/Plasma Properties

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Barrier Characteristics
Analysis: RBS, Rutherford Backscattering Spectrometry

Substrates

Si(100)
SiO2

Keywords

Diffusion Barrier

Notes

Si(100) samples HF cleaned.
Barrier test samples Ar annealed 450, 550, and 650C.
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