TBTDET, tert-butylimido tris(diethylamino)tantalum, Ta[NEt2]3[=N-t-Bu)3], CAS# 169896-41-7

Where to buy

NumberVendorRegionLink
1Sigma-Aldrich, Co. LLCπŸ‡ΊπŸ‡ΈTris(diethylamido)(tert-butylimido)tantalum(V)
2GelestπŸ‡ΊπŸ‡ΈTris(Diethylamino)(t-Butylimino) Tantalum
3Santa Cruz BiotechnologyπŸ‡ΊπŸ‡ΈTris(diethylamido)(tert-butylimido)tantalum(V)
4EreztechπŸ‡ΊπŸ‡ΈTris(diethylamido) (tert-butylimido) tantalum(V)
5Strem Chemicals, Inc.πŸ‡ΊπŸ‡Έ(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)
6Pegasus ChemicalsπŸ‡¬πŸ‡§Tris(diethylamido)(tert-butylimido)tantalum(V)
7Alfa AesarπŸ‡ΊπŸ‡ΈTert-butylimido tris(diethylamido) tantalum
8Alfa AesarπŸ‡ΊπŸ‡ΈTantalum tris(diethylamido)-tert-butylimide, 99.99% (metals basis)

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 27 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
2The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
3Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
4Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
5Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
6A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
7The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
8Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
9Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
10Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
11Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
12Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
13Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
14Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
15High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
16Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
17Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
18Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
19High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
20Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
21Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
22Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
23Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
24Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
25Evaluation of plasma parameters on PEALD deposited TaCN
26Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
27Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications