TBTDET, tert-butylimido tris(diethylamino)tantalum, Ta[NEt2]3[=N-t-Bu)3], CAS# 169896-41-7

Where to buy

NumberVendorRegionLink
1Sigma-Aldrich, Co. LLCπŸ‡ΊπŸ‡ΈTris(diethylamido)(tert-butylimido)tantalum(V)
2EreztechπŸ‡ΊπŸ‡ΈTris(diethylamido) (tert-butylimido) tantalum(V)
3EpiValenceπŸ‡¬πŸ‡§Tantalum tert-butylimido trisdiethylamide
4GelestπŸ‡ΊπŸ‡ΈTris(Diethylamino)(t-Butylimino) Tantalum
5Strem Chemicals, Inc.πŸ‡ΊπŸ‡Έ(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)
6Santa Cruz BiotechnologyπŸ‡ΊπŸ‡ΈTris(diethylamido)(tert-butylimido)tantalum(V)
7Alfa AesarπŸ‡ΊπŸ‡ΈTantalum tris(diethylamido)-tert-butylimide, 99.99% (metals basis)
8Alfa AesarπŸ‡ΊπŸ‡ΈTert-butylimido tris(diethylamido) tantalum
9Pegasus ChemicalsπŸ‡¬πŸ‡§Tris(diethylamido)(tert-butylimido)tantalum(V)

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 26 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
2Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
3Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
4Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
5Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
6Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
7Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
8Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
9The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
10Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
11Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
12The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
13Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
14Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
15Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
16Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
17Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
18A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
19High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
20Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
21High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
22Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
23Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
24Evaluation of plasma parameters on PEALD deposited TaCN
25Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
26Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent