TBTDET, tert-butylimido tris(diethylamino)tantalum, Ta[NEt2]3[=N-t-Bu)3], CAS# 169896-41-7

Where to buy

NumberVendorRegionLink
1Pegasus Chemicals🇬🇧Tris(diethylamido)(tert-butylimido)tantalum(V)
2Strem Chemicals, Inc.🇺🇸(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)
3Sigma-Aldrich, Co. LLC🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
4Santa Cruz Biotechnology🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
5Alfa Aesar🇺🇸Tantalum tris(diethylamido)-tert-butylimide, 99.99% (metals basis)
6EpiValence🇬🇧Tantalum tert-butylimido trisdiethylamide
7Gelest🇺🇸Tris(Diethylamino)(t-Butylimino) Tantalum
8Alfa Aesar🇺🇸Tert-butylimido tris(diethylamido) tantalum
9Ereztech🇺🇸Tris(diethylamido) (tert-butylimido) tantalum(V)

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 26 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
2Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
3Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
4The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
5Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
6Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
7Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
8Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
9Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
10Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
11A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
12High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
13Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
14Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
15Evaluation of plasma parameters on PEALD deposited TaCN
16Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
17Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
18The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
19Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
20Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
21Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
22Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
23Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
24Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
25Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
26High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating