TBTDET, tert-butylimido tris(diethylamino)tantalum, Ta[NEt2]3[=N-t-Bu)3], CAS# 169896-41-7

Where to buy

NumberVendorRegionLink
1Sigma-Aldrich, Co. LLC🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
2Gelest🇺🇸Tris(Diethylamino)(t-Butylimino) Tantalum
3Alfa Aesar🇺🇸Tert-butylimido tris(diethylamido) tantalum
4Alfa Aesar🇺🇸Tantalum tris(diethylamido)-tert-butylimide, 99.99% (metals basis)
5Pegasus Chemicals🇬🇧Tris(diethylamido)(tert-butylimido)tantalum(V)
6Santa Cruz Biotechnology🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
7Ereztech🇺🇸Tris(diethylamido) (tert-butylimido) tantalum(V)
8Strem Chemicals, Inc.🇺🇸(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 27 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
2Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
3Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
4Evaluation of plasma parameters on PEALD deposited TaCN
5The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
6Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
7Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
8Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
9Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
10Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
11Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
12Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
13Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
14Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
15High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
16High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
17Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
18Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
19Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
20Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
21The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
22Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
23Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
24Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
25Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
26Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
27A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu