TBTDET, tert-butylimido tris(diethylamino)tantalum, Ta[NEt2]3[=N-t-Bu)3], CAS# 169896-41-7

Where to buy

NumberVendorRegionLink
1Santa Cruz Biotechnology🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
2Gelest🇺🇸Tris(Diethylamino)(t-Butylimino) Tantalum
3Pegasus Chemicals🇬🇧Tris(diethylamido)(tert-butylimido)tantalum(V)
4Strem Chemicals, Inc.🇺🇸(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)
5Ereztech🇺🇸Tris(diethylamido) (tert-butylimido) tantalum(V)
6Alfa Aesar🇺🇸Tantalum tris(diethylamido)-tert-butylimide, 99.99% (metals basis)
7Sigma-Aldrich, Co. LLC🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
8Alfa Aesar🇺🇸Tert-butylimido tris(diethylamido) tantalum

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 27 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
2Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
3Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
4The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
5Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
6Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
7Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
8Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
9The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
10Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
11Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
12Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
13Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
14Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
15Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
16Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
17Evaluation of plasma parameters on PEALD deposited TaCN
18Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
19High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
20Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
21Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
22Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
23Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
24A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
25Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
26High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
27Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals