TBTDET, Tert-Butylimido Tris(DiEthylamino) Tantalum, Ta[N(C2H5)2]3[=NC(CH3)3], CAS# 169896-41-7

Where to buy

NumberVendorLink
1EreztechTris(diethylamido)(tert-butylimido)tantalum(V) (99.99+%-Ta)
2Strem Chemicals, Inc.(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 22 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
2Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
3Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
4Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
5Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
6A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
7Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
8Evaluation of plasma parameters on PEALD deposited TaCN
9Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
10Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
11Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
12Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
13The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
14Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
15Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
16Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
17Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
18Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
19Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
20Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
21The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
22Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications


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