TBTDET, tert-butylimido tris(diethylamino)tantalum, Ta[NEt2]3[=N-t-Bu)3], CAS# 169896-41-7

Where to buy

NumberVendorRegionLink
1Pegasus Chemicals🇬🇧Tris(diethylamido)(tert-butylimido)tantalum(V)
2EpiValence🇬🇧Tantalum tert-butylimido trisdiethylamide
3Sigma-Aldrich, Co. LLC🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)
4Strem Chemicals, Inc.🇺🇸(t-Butylimido)tris(diethylamino)tantalum(V), min. 98% (99.99%-Ta)
5Alfa Aesar🇺🇸Tert-butylimido tris(diethylamido) tantalum
6Alfa Aesar🇺🇸Tantalum tris(diethylamido)-tert-butylimide, 99.99% (metals basis)
7Ereztech🇺🇸Tris(diethylamido) (tert-butylimido) tantalum(V)
8Gelest🇺🇸Tris(Diethylamino)(t-Butylimino) Tantalum
9Santa Cruz Biotechnology🇺🇸Tris(diethylamido)(tert-butylimido)tantalum(V)

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Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 26 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
2Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
3Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
4Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
5High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
6The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
7Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
8High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
9Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
10Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
11Selective deposition of Ta2O5 by adding plasma etching super-cycles in plasma enhanced atomic layer deposition steps
12Evaluation of plasma parameters on PEALD deposited TaCN
13Properties of Plasma-Enhanced Atomic Layer Deposition-Grown Tantalum Carbonitride Thin Films
14A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
15Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
16Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
17Plasma-Enhanced Atomic Layer Deposition of TaCxNy Films with tert-Butylimido Tris-diethylamido Tantalum and Methane-Hydrogen Gas
18Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
19Interface and plasma damage analysis of PEALD TaCN deposited on HfO2 for advanced CMOS studied by angle resolved XPS and C-V
20Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
21Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
22The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
23Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
24Formation of Tantalum Carbide and Nitride Phases in Atomic Layer Deposition Using Hydrogen Plasma and tert-Butylimidotris( diethylamido)-tantalum (TBTDET), and its Effect on Material Properties
25Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
26Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications