Publication Information

Title:
Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 45, No. 4, pp. 1069-1073
Date:
2004-06-04

Author Information

Name Institution
Ju Youn KimHanyang University
Keunwoo LeeHanyang University
Hee Ok ParkHanyang University
Young-Do KimHanyang University
Hyeongtag JeonHanyang University
Yangdo KimPusan National University

Films

Thermal TaNx


Plasma TaNx


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Barrier Characteristics
Analysis: Four-point Probe

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Barrier Characteristics
Analysis: SEM, Scanning Electron Microscopy

Substrates

Si(100)

Keywords

Diffusion Barrier
Plasma vs Thermal Comparison

Notes

1195