TaNx Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for plasma enhanced atomic layer deposition publications discussing TaNx films returned 37 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1The Growth of Tantalum Thin Films by Plasma-Enhanced Atomic Layer Deposition and Diffusion Barrier Properties
2Robust TaNx diffusion barrier for Cu-interconnect technology with subnanometer thickness by metal-organic plasma-enhanced atomic layer deposition
3Ru thin film grown on TaN by plasma enhanced atomic layer deposition
4High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
5Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
6Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
7Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
8Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
9Trilayer Tunnel Selectors for Memristor Memory Cells
10Plasma-Enhanced Atomic Layer Deposition of TaN Thin Films Using Tantalum-Pentafluoride and N2/H2/Ar Plasma
11Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
12Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
13Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
14High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
15ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
16Plasma-enhanced atomic layer deposition of tantalum nitride thin films using tertiary-amylimido-tris(dimethylamido)tantalum and hydrogen plasma
17Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
18Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
19Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
20Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
21Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor
22Plasma-Enhanced Atomic Layer Deposition of Tantalum Nitrides Using Hydrogen Radicals as a Reducing Agent
23Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
24Atomic layer deposition of Ta-based thin films: Reactions of alkylamide precursor with various reactants
25Reaction mechanisms of atomic layer deposition of TaNx from Ta(NMe2)5 precursor and H2-based plasmas
26Ta-rich atomic layer deposition TaN adhesion layer for Cu interconnects by means of plasma-enhanced atomic layer deposition
27Nucleation and growth of tantalum nitride atomic layer deposition on Al2O3 using TBTDET and hydrogen radicals
28Electrical and structural properties of conductive nitride films grown by plasma enhanced atomic layer deposition with significant ion bombardment effect
29Optical emission spectroscopy as a tool for studying, optimizing, and monitoring plasma-assisted atomic layer deposition processes
30Improvement of Copper Diffusion Barrier Properties of Tantalum Nitride Films by Incorporating Ruthenium Using PEALD
31A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
32Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
33The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
34Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
35Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
36The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
37Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers