Publication Information

Title: Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper

Type: Journal

Info: Journal of The Electrochemical Society, 157 (2) G62-G66 (2010)

Date: 2009-10-01

DOI: http://dx.doi.org/10.1149/1.3267881

Author Information

Name

Institution

National Chiao Tung University

National Chiao Tung University

National Chiao Tung University

Films

Plasma TaNx using Custom

Deposition Temperature = 300C

7721-01-9

1333-74-0

7727-37-9

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Adhesion

Bending Test, Four Point Bend Delamination Test

-

Adhesion

Pull-off tensile test

-

Morphology, Roughness, Topography

SEM, Scanning Electron Microscopy

JEOL JSM-6500F

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Digital Instruments Nanoscope E

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

Thermo VG 350

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

-

Microstructure

TEM, Transmission Electron Microscope

FEI Technai F20

Substrates

SiO2

Si(100)

Keywords

Adhesion

Interconnect

Notes

722



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