Publication Information

Title:
Effect of Surface Reduction Treatments of Plasma-Enhanced Atomic Layer Chemical Vapor Deposited TaNx on Adhesion with Copper
Type:
Journal
Info:
Journal of The Electrochemical Society, 157 (2) G62-G66 (2010)
Date:
2009-10-01

Author Information

Name Institution
Chih-Chieh ChangNational Chiao Tung University
Fu-Ming PanNational Chiao Tung University
Ching-Wen ChenNational Chiao Tung University

Films

Plasma TaNx

Hardware used: Custom


CAS#: 1333-74-0

CAS#: 7727-37-9

Film/Plasma Properties

Characteristic: Adhesion
Analysis: Bending Test, Four Point Bend Delamination Test

Characteristic: Adhesion
Analysis: Pull-off tensile test

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Substrates

SiO2
Si(100)

Keywords

Adhesion
Interconnect

Notes

722