Publication Information

Title:
ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
Type:
Journal
Info:
ECS Transactions, 69 (7) 161-169 (2015)
Date:
2015-10-11

Author Information

Name Institution
Joyeeta NagIBM
Brian CohenIBM
Samuel ChoiIBM
Atsushi OginoIBM
Minseok OhIBM
Yan YanIBM
Jim LiangIBM
Cathryn ChristiansenIBM
Andrew KimIBM
Baozhen LiIBM
Patrick DeHavenIBM
Anita MadanIBM
Siddarth KrishnanIBM
Andrew H SimonIBM

Films

Plasma TaNx

Hardware used: Unknown


Thermal TaNx

Hardware used: Unknown


Film/Plasma Properties

Substrates

Keywords

Notes

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