ALD TaN Barrier for Enhanced Performance with Low Contact Resistance for 14nm Technology Node Cu Interconnects
Type:
Journal
Info:
ECS Transactions, 69 (7) 161-169 (2015)
Date:
2015-10-11
Author Information
| Name | Institution |
|---|---|
| Joyeeta Nag | IBM |
| Brian Cohen | IBM |
| Samuel Choi | IBM |
| Atsushi Ogino | IBM |
| Minseok Oh | IBM |
| Yan Yan | IBM |
| Jim Liang | IBM |
| Cathryn Christiansen | IBM |
| Andrew Kim | IBM |
| Baozhen Li | IBM |
| Patrick DeHaven | IBM |
| Anita Madan | IBM |
| Siddarth Krishnan | IBM |
| Andrew H Simon | IBM |
Films
Film/Plasma Properties
Substrates
Notes
| 418 |