High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
Type:
Conference Proceedings
Info:
High-k oxides by ALD, At Wrocław, Poland
Date:
2018-03-01
Author Information
Name | Institution |
---|---|
Sebastian Killge | Technische Universität Dresden |
Johanna Reif | Technische Universität Dresden |
Volker Neumann | Technische Universität Dresden |
Marcel Junige | University of Colorado, Boulder |
Marion Geidel | Technische Universität Dresden |
Christian Wenzel | Technische Universität Dresden |
Martin Knaut | Technische Universität Dresden |
Matthias Albert | Technische Universität Dresden |
Johann W. Bartha | Technische Universität Dresden |
Films
Thermal Ru
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Adhesion
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Substrates
SiO2 |
Notes
1281 |