NH3, Ammonia, CAS# 7664-41-7

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 232 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1AC-Capacitance Techniques for Interface Trap Analysis in GaN-Based Buried-Channel MIS-HEMTs
2Effect of NH3 plasma passivation on the electrical characteristics of a nanolaminated ALD HfAlO on InGaAs MOS capacitor
3In0.53Ga0.47As FinFET and GAA-FET With Remote-Plasma Treatment
4Nitride passivation of the interface between high-k dielectrics and SiGe
5Hollow cathode plasma-assisted atomic layer deposition of crystalline AlN, GaN and AlxGa1-xN thin films at low temperatures
6Low-temperature hollow cathode plasma-assisted atomic layer deposition of crystalline III-nitride thin films and nanostructures
7823-mA/mm Drain Current Density and 945-MW/cm2 Baliga's Figure-of-Merit Enhancement-Mode GaN MISFETs With a Novel PEALD-AlN/LPCVD-Si3N4 Dual-Gate Dielectric
8A comparative study of AlN and Al2O3 based gate stacks grown by atomic layer deposition on InGaAs
9A rotary reactor for thermal and plasma-enhanced atomic layer deposition on powders and small objects
10AlN Surface Passivation of GaN-Based High Electron Mobility Transistors by Plasma-Enhanced Atomic Layer Deposition
11Aluminum Nitride Transition Layer for Power Electronics Applications Grown by Plasma-Enhanced Atomic Layer Deposition
12Antioxidation properties of Ti0.83Al0.17N prepared using plasma-enhanced atomic layer deposition
13Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma
14Atomic Layer Deposition of AlN Thin Films in Three Different Growth Regimes
15Atomic Layer Deposition of Aluminum Nitride Thin films from Trimethyl Aluminum (TMA) and Ammonia
16Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
17Comparative study on interface and bulk charges in AlGaN/GaN metal-insulator-semiconductor heterostructures with Al2O3, AlN, and Al2O3/AlN laminated dielectrics
18Comparison of ammonia plasma and AlN passivation by plasma-enhanced atomic layer deposition
19Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films
20Comparison of plasma-enhanced atomic layer deposition AlN films prepared with different plasma sources
21Conformality of Al2O3 and AlN Deposited by Plasma-Enhanced Atomic Layer Deposition
22Controlling the composition of Ti1-xAlxN thin films by modifying the number of TiN and AlN subcycles in atomic layer deposition
23Crystalline growth of AlN thin films by atomic layer deposition
24Current transport mechanisms in plasma-enhanced atomic layer deposited AlN thin films
25Effect of Film Thickness on the Electrical Properties of AlN Films Prepared by Plasma-Enhanced Atomic Layer Deposition
26Electrical Characteristics of n, p-In0.53Ga0.47As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
27Formation of aluminum nitride thin films as gate dielectrics on Si(100)
28GaAs surface passivation by plasma-enhanced atomic-layer-deposited aluminum nitride
29Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer
30Growth of aluminum nitride thin films prepared by plasma-enhanced atomic layer deposition
31High-k GaAs metal insulator semiconductor capacitors passivated by ex-situ plasma-enhanced atomic layer deposited AlN for Fermi-level unpinning
32Hollow cathode plasma-assisted atomic layer deposition of crystalline AlN, GaN and AlxGa1-xN thin films at low temperatures
33Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO2/In0.53Ga0.47As Gate-Stack
34Improved Interface and Transport Properties of AlGaN/GaN MIS-HEMTs With PEALD-Grown AlN Gate Dielectric
35Influence of plasma chemistry on impurity incorporation in AlN prepared by plasma enhanced atomic layer deposition
36Initial growth, refractive index, and crystallinity of thermal and plasma-enhanced atomic layer deposition AlN films
37Low-temperature hollow cathode plasma-assisted atomic layer deposition of crystalline III-nitride thin films and nanostructures
38Low-Temperature Self-Limiting Growth of III-Nitride Thin Films by Plasma-Enhanced Atomic Layer Deposition
39Optical properties of AlN thin films grown by plasma enhanced atomic layer deposition
40Passivation of InGaAs interface states by thin AlN interface layers for metal-insulator-semiconductor applications
41PEALD AlN: controlling growth and film crystallinity
42Plasma Enhanced Atomic Layer Deposition Passivated HfO2/AlN/In0.53Ga0.47As MOSCAPs With Sub-Nanometer Equivalent Oxide Thickness and Low Interface Trap Density
43Plasma etch characteristics of aluminum nitride mask layers grown by low-temperature plasma enhanced atomic layer deposition in SF6 based plasmas
44Plasma-Enhanced Atomic Layer Deposition of III-Nitride Thin Films
45Preparation of Al2O3 and AlN Nanotubes by Atomic Layer Deposition
46Properties of AlN grown by plasma enhanced atomic layer deposition
47Self-limiting growth of GaN using plasma-enhanced atomic layer deposition
48Self-limiting low-temperature growth of crystalline AlN thin films by plasma-enhanced atomic layer deposition
49Silicon surface passivation with atomic layer deposited aluminum nitride
50Structural and electrical properties of AlN thin films on GaN substrates grown by plasma enhanced-Atomic Layer Deposition
51Structural properties of AlN films deposited by plasma-enhanced atomic layer deposition at different growth temperatures
52Suppression of interfacial layer in high-K gate stack with crystalline high-K dielectric and AlN buffer layer structure
53Surface passivation of GaAs nanowires by the atomic layer deposition of AlN
54Template-Based Synthesis of Aluminum Nitride Hollow Nanofibers Via Plasma-Enhanced Atomic Layer Deposition
55The Influence of Growth Temperature on the Properties of AlN Films Grown by Atomic Layer Deposition
56The influence of N2/H2 and ammonia N source materials on optical and structural properties of AlN films grown by plasma enhanced atomic layer deposition
57Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
58Thin effective oxide thickness (~0.5 nm) and low leakage current gate dielectric for Ge MOS devices by plasma nitrided Al2O3 intermediate layer
59TiN/AlN Nano Multilayers Film Fabricated by Plasma Enhanced Atomic Layer Deposition
60Improvement of Capacitance Equivalent Thickness, Leakage Current, and Interfacial State Density Based on Crystallized High-K Dielectrics/Nitrided Buffer Layer Gate Stacks
61Interface engineering of an AlNO/AlGaN/GaN MIS diode induced by PEALD alternate insertion of AlN in Al2O3
62Plasma nitridation of atomic layer deposition (ALD) Al2O3 by NH3 in plasma-enhanced chemical vapor deposition (PECVD) for silicon solar cell
63Large-scale synthesis of uniform hexagonal boron nitride films by plasma-enhanced atomic layer deposition
64Characteristics of Cobalt Films Deposited by Using a Remote Plasma ALD Method with a CpCo(CO)2 Precursor
65Degradation of the deposition blocking layer during area-selective plasma-enhanced atomic layer deposition of cobalt
66Growth mechanism of Co thin films formed by plasma-enhanced atomic layer deposition using NH3 as plasma reactant
67High-Quality Cobalt Thin Films by Plasma-Enhanced Atomic Layer Deposition
68Hot-wire-assisted atomic layer deposition of a high quality cobalt film using cobaltocene: Elementary reaction analysis on NHx radical formation
69Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
70Plasma-Enhanced Atomic Layer Deposition of Cobalt Using Cyclopentadienyl Isopropyl Acetamidinato-Cobalt as a Precursor
71Spontaneous Formation of Vertical Magnetic-Metal-Nanorod Arrays During Plasma-Enhanced Atomic Layer Deposition
72Carbon nanotube-supported Cu3N nanocrystals as a highly active catalyst for oxygen reduction reaction
73Atomic layer deposition of GaN at low temperatures
74Electron Enhanced Growth of Crystalline Gallium Nitride Thin Films at Room Temperature and 100°C Using Sequential Surface Reactions
75Electronic and optical device applications of hollow cathode plasma assisted atomic layer deposition based GaN thin films
76Growth kinetics for temperature-controlled atomic layer deposition of GaN using trimethylgallium and remote-plasma-excited NH3
77Hollow cathode plasma-assisted atomic layer deposition of crystalline AlN, GaN and AlxGa1-xN thin films at low temperatures
78Infrared study on low temperature atomic layer deposition of GaN using trimethylgallium and plasma-excited ammonia
79Low-temperature hollow cathode plasma-assisted atomic layer deposition of crystalline III-nitride thin films and nanostructures
80Low-Temperature Self-Limiting Growth of III-Nitride Thin Films by Plasma-Enhanced Atomic Layer Deposition
81Plasma-Enhanced Atomic Layer Deposition of III-Nitride Thin Films
82Self-Limiting Growth of GaN at Low Temperatures
83Self-limiting growth of GaN using plasma-enhanced atomic layer deposition
84Temperature-controlled atomic layer deposition of GaN using plasma-excited nitrogen source
85Ultralow threading dislocation density in GaN epilayer on near-strain-free GaN compliant buffer layer and its applications in hetero-epitaxial LEDs
86Uniform GaN thin films grown on (100) silicon by remote plasma atomic layer deposition
87A comparison between remote plasma-enhanced and thermal ALD of Hafnium-nitride thin films
88Effect of NH3 plasma passivation on the electrical characteristics of a nanolaminated ALD HfAlO on InGaAs MOS capacitor
89Characterization of HfOxNy thin film formation by in-situ plasma enhanced atomic layer deposition using NH3 and N2 plasmas
90Enhanced electrical and reliability characteristics in HfON gated Ge p-MOSFETs with H2 and NH3 plasma treated interfacial layers
91Improvement in electrical characteristics of HfO2 gate dielectrics treated by remote NH3 plasma
92Low-temperature hollow cathode plasma-assisted atomic layer deposition of crystalline III-nitride thin films and nanostructures
93Enhancement of the TiO2 Thin-Film Dielectric Constant Through Pretreatment of Ir Substrate
94Improvement of Morphological Stability of PEALD-Iridium Thin Films by Adopting Two-Step Annealing Process
95Deposition Of MnO Anode And MnO2 Cathode Thin Films By Plasma Enhanced Atomic Layer Deposition Using The Mn(thd)3 Precursor
96Manganese oxide films with controlled oxidation state for water splitting devices through a combination of atomic layer deposition and post-deposition annealing
97Plasma-enhanced ALD system for SRF cavity
98Tribological properties of thin films made by atomic layer deposition sliding against silicon
99Characteristics of Nickel Thin Film and Formation of Nickel Silicide by Remote Plasma Atomic Layer Deposition using Ni(iPr-DAD)2
100Formation of Ni silicide from atomic layer deposited Ni
101Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
102Plasma-assisted atomic layer deposition and post-annealing enhancement of low resistivity and oxygen-free nickel nano-films using nickelocene and ammonia precursors
103Plasma-Assisted Atomic Layer Deposition of High-Density Ni Nanoparticles for Amorphous In-Ga-Zn-O Thin Film Transistor Memory
104Plasma-Enhanced Atomic Layer Deposition of Ni
105Plasma-enhanced atomic layer deposition of nickel thin film using bis(1,4-diisopropyl-1,4-diazabutadiene)nickel
106Spontaneous Formation of Vertical Magnetic-Metal-Nanorod Arrays During Plasma-Enhanced Atomic Layer Deposition
107Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
108Plasma enhanced atomic layer deposited platinum thin film on Si substrate with TMA pretreatment
109A Bilayer Diffusion Barrier of ALD-Ru/ALD-TaCN for Direct Plating of Cu
110Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
111Atomic Layer Deposition of Ru Nanocrystals with a Tunable Density and Size for Charge Storage Memory Device Application
112Atomic Layer Deposition of Ru Thin Films Using a New Beta-Diketonate Ru Precursor and NH3 Plasma as a Reactant
113Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
114Characterization of Ultrathin PEALD-Grown RuCo Films for Diffusion Barrier and Copper Direct-Plate Applications
115Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition
116Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
117Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
118Effects of Ar plasma treatment for deposition of ruthenium film by remote plasma atomic layer deposition
119Formation of Ru nanocrystals by plasma enhanced atomic layer deposition for nonvolatile memory applications
120Improvement of the thermal stability of nickel silicide using a ruthenium interlayer deposited via remote plasma atomic layer deposition
121Initial Stages of Ruthenium Film Growth in Plasma-Enhanced Atomic Layer Deposition
122Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
123PEALD of a Ruthenium Adhesion Layer for Copper Interconnects
124Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
125Plasma-Enhanced Atomic Layer Deposition of Ruthenium Thin Films
126Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
127Preparation of Ru thin film layer on Si and TaN/Si as diffusion barrier by plasma enhanced atomic layer deposition
128Ru thin film grown on TaN by plasma enhanced atomic layer deposition
129Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
130The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
131The properties of Ru films deposited by remote plasma atomic layer deposition on Ar plasma-treated SiO2
132Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
133Development of plasma-enhanced atomic layer deposition grown Ru-WCN mixed phase films for nanoscale diffusion barrier and copper direct-plate applications
134Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
135Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
136Formation of Nano-Crystalline Ru-Based Ternary Thin Films by Plasma-Enhanced Atomic Layer Deposition
137Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
138Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
139Microstructure analysis of plasma enhanced atomic layer deposition-grown mixed-phase RuTaN barrier for seedless copper electrodeposition
140Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
141Atomic Layer Epitaxy of Group IV Materials: Surface Processes, Thin Films, Devices and Their Characterization
142A Silicon Nitride MIM Capacitor for Analog/Mixed-Signal Integrated Circuit using Manufacturable Atomic Layer Deposition Equipment
143Atomic layer controlled deposition of silicon nitride with self-limiting mechanism
144Atomic Layer Deposition of Silicon Nitride from Bis(tert-butylamino)silane and N2 Plasma
145Atomic Layer Deposition of SiN for spacer applications in high-end logic devices
146Challenges in atomic layer deposition of carbon-containing silicon-based dielectrics
147Challenges in spacer process development for leading-edge high-k metal gate technology
148Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
149Correlation of film density and wet etch rate in hydrofluoric acid of plasma enhanced atomic layer deposited silicon nitride
150Dielectric barrier characteristics of Si-rich silicon nitride films deposited by plasma enhanced atomic layer deposition
151Low-Temperature Conformal Atomic Layer Deposition of SiNx Films Using Si2Cl6 and NH3 Plasma
152Low-temperature SiON films deposited by plasma-enhanced atomic layer deposition method using activated silicon precursor
153Measurements and modeling of the impact of radical recombination on silicon nitride growth in microwave plasma assisted atomic layer deposition
154Reactivity of different surface sites with silicon chlorides during atomic layer deposition of silicon nitride
155Role of Surface Termination in Atomic Layer Deposition of Silicon Nitride
156Temperature dependence of silicon nitride deposited by remote plasma atomic layer deposition
157The effect of plasma power on the properties of low-temperature silicon nitride deposited by RPALD for a gate spacer
158Low Temperature Formation of Silicon Oxide Thin Films by Atomic Layer Deposition Using NH3/O2 Plasma
159Phase Formation in the Tantalum Carbonitride Film Deposited with Atomic Layer Deposition Using Ammonia
160The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum- Based Thin Films for Copper Diffusion Barrier Applications
161A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
162Atomic layer deposition of Ta-based thin films: Reactions of alkylamide precursor with various reactants
163Barrier Characteristics of TaN Films Deposited by Using the Remote Plasma Enhanced Atomic Layer Deposition Method
164Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
165Diffusion barrier properties of TaNx films prepared by plasma enhanced atomic layer deposition from PDMAT with N2 or NH3 plasma
166Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex
167High-aspect-ratio TSVs with thALD/PEALD tantalum-based barrier layer, thALD Ruthenium seed layer and subsequent copper electroplating
168Integration of Atomic Layer Deposition-Grown Copper Seed Layers for Cu Electroplating Applications
169Plasma Enhanced Atomic Layer Deposition of TaN Films for Advanced Interconnects
170Plasma-Enhanced Atomic Layer Deposition of Ta-N Thin Films
171Plasma-enhanced Atomic Layer Deposition of TaN Film and Its Resistance to Copper Diffusion
172Ru thin film grown on TaN by plasma enhanced atomic layer deposition
173Synthesis and in situ characterization of low-resistivity TaNx films by remote plasma atomic layer deposition
174Thermal and plasma enhanced atomic layer deposition ruthenium and electrical characterization as a metal electrode
175Trilayer Tunnel Selectors for Memristor Memory Cells
176Tribological properties of thin films made by atomic layer deposition sliding against silicon
177Antioxidation properties of Ti0.83Al0.17N prepared using plasma-enhanced atomic layer deposition
178Controlling the composition of Ti1-xAlxN thin films by modifying the number of TiN and AlN subcycles in atomic layer deposition
179Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
180Plasma Enhanced Atomic Layer Deposition of TiCxNy Film with Various Reactive Gases
181Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
182Atomic Layer Deposition (ALD) grown thin films for ultra-fine pitch pixel detectors
183Atomic Layer Deposition of TiN/Al2O3/TiN Nanolaminates for Capacitor Applications
184Atomic layer deposition of titanium nitride from TDMAT precursor
185Bipolar Resistive Switching Characteristics of HfO2/TiO2/HfO2 Trilayer-Structure RRAM Devices on Pt and TiN-Coated Substrates Fabricated by Atomic Layer Deposition
186Characteristics and Compositional Variation of TiN Films Deposited by Remote PEALD on Contact Holes
187Controllable nitrogen doping in as deposited TiO2 film and its effect on post deposition annealing
188Electron Transport Across Ultrathin Ferroelectric Hf0.5Zr0.5O2 Films on Si
189Excellent resistive switching properties of atomic layer-deposited Al2O3/HfO2/Al2O3 trilayer structures for non-volatile memory applications
190Ferroelectric properties of full plasma-enhanced ALD TiN/La:HfO2/TiN stacks
191Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
192Hot-Wire Generated Atomic Hydrogen and its Impact on Thermal ALD in TiCl4/NH3 System
193In situ dry cleaning of Si wafer using OF2/NH3 remote plasma with low global warming potential
194Low-impurity, highly conformal atomic layer deposition of titanium nitride using NH3-Ar-H2 plasma treatment for capacitor electrodes
195NiCO2O4@TiN Core-shell Electrodes through Conformal Atomic Layer Deposition for All-solid-state Supercapacitors
196Photoelectrochemical hydrogen production on silicon microwire arrays overlaid with ultrathin titanium nitride
197Plasma-Enhanced Atomic Layer Deposition (PEALD) of TiN using the Organic Precursor Tetrakis(ethylmethylamido)Titanium (TEMAT)
198Potassium Permanganate-Based Slurry to Reduce the Galvanic Corrosion of the Cu/Ru/TiN Barrier Liner Stack during CMP in the BEOL Interconnects
199Preparation of Lithium Containing Oxides by the Solid State Reaction of Atomic Layer Deposited Thin Films
200Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
201Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
202Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
203Role of reactive gas on the structure and properties of titanium nitride films grown by plasma enhanced atomic layer deposition
204Synaptic Plasticity and Learning Behaviors Mimicked in Single Inorganic Synapses of Pt/HfOx/ZnOx/TiN Memristive System
205Thermal and Plasma-Enhanced Atomic Layer Deposition of TiN Using TDMAT and NH3 on Particles Agitated in a Rotary Reactor
206Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality
207Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN
208TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
209TiN/AlN Nano Multilayers Film Fabricated by Plasma Enhanced Atomic Layer Deposition
210Tribological properties of thin films made by atomic layer deposition sliding against silicon
211Tunable Work-Function Engineering of TiC-TiN Compound by Atomic Layer Deposition for Metal Gate Applications
212Analysis of nitrogen species in titanium oxynitride ALD films
213Analysis of titanium species in titanium oxynitride films prepared by plasma enhanced atomic layer deposition
214In-gap states in titanium dioxide and oxynitride atomic layer deposited films
215Plasma-enhanced atomic layer deposition of titanium oxynitrides films: A comparative spectroscopic and electrical study
216Low temperature plasma-enhanced atomic layer deposition of thin vanadium nitride layers for copper diffusion barriers
217Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten
218Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
219Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
220Work function tuning of plasma-enhanced atomic layer deposited WCxNy electrodes for metal/oxide/semiconductor devices
221A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
222Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
223Effects of NH3 pulse plasma on atomic layer deposition of tungsten nitride diffusion barrier
224Investigation of Tungsten Nitride Deposition Using Tungsten Hexafluoride Precursor for Via and Plug Metallization
225Method to enhance atomic-layer deposition of tungsten-nitride diffusion barrier for Cu interconnect
226Plasma-enhanced atomic layer deposition of tungsten nitride
227Pulse plasma assisted atomic layer deposition of W–C–N thin films for Cu interconnects
228WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications
229Local Electronic Structures and Electrical Characteristics of Well-Controlled Nitrogen-Doped ZnO Thin Films Prepared by Remote Plasma In situ Atomic Layer Doping
230Ultraviolet Electroluminescence from Nitrogen-Doped ZnO-Based Heterojuntion Light-Emitting Diodes Prepared by Remote Plasma in situ Atomic Layer-Doping Technique
231Enhancement of Electrical Characteristics and Reliability in Crystallized ZrO2 Gate Dielectrics Treated with In-Situ Atomic Layer Doping of Nitrogen
232Impact of nitrogen depth profiles on the electrical properties of crystalline high-K gate dielectrics


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