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TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
Type:
Journal
Info:
Journal of The Electrochemical Society, 152 (8) G589-G593 (2005)
Date:
2005-01-31
Author Information
| Name | Institution |
|---|---|
| Kai-Erik Elers | ASM Microchemistry Oy |
| Jerry Winkler | ASM Microchemistry Oy |
| Keith Weeks | ASM Microchemistry Oy |
| Steven Marcus | ASM Microchemistry Oy |
Films
Thermal TiN
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Substrates
| Silicon |
Notes
| 1008 |