Publication Information

Title:
TiCl4 as a Precursor in the TiN Deposition by ALD and PEALD
Type:
Journal
Info:
Journal of The Electrochemical Society, 152 (8) G589-G593 (2005)
Date:
2005-01-31

Author Information

Name Institution
Kai-Erik ElersASM Microchemistry Oy
Jerry WinklerASM Microchemistry Oy
Keith WeeksASM Microchemistry Oy
Steven MarcusASM Microchemistry Oy

Films

Thermal TiN


Plasma TiN


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Substrates

Silicon

Keywords

Notes

1008