Characteristics of Cobalt Films Deposited by Using a Remote Plasma ALD Method with a CpCo(CO)2 Precursor

Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 50, No. 4, April 2007, pp. 1141-1146
Date:
2007-01-22

Author Information

Name Institution
Keunwoo LeeHanyang University
Keunjun KimHanyang University
Hyeongtag JeonHanyang University
Youngjin LeeHynix Semiconductor
Jeongtae KimHynix Semiconductor
Seungjin YeomHynix Semiconductor

Films

Plasma Co


Plasma Co


Plasma Co


Plasma Co


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Microstructure
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Substrates

Si(100)

Notes

1010