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WNx Film Prepared by Atomic Layer Deposition using F-Free BTBMW and NH3 Plasma Radical for ULSI Applications
Type:
Conference Proceedings
Info:
ECS Transactions, 3 (15) 147-152 (2007)
Date:
2007-07-01
Author Information
| Name | Institution |
|---|---|
| Dong Ho You | IPS Ltd. |
| Soo-Hyun Kim | IPS Ltd. |
| Ki-Hoon Lee | IPS Ltd. |
| Sang Kyu Lee | IPS Ltd. |
| Tea Wook Seo | IPS Ltd. |
Films
Plasma WN
Thermal WN
Plasma WN
Film/Plasma Properties
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Interlayer
Analysis: TEM, Transmission Electron Microscope
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| SiO2 |
Notes
| 1177 |