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Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
Type:
Journal
Info:
J. Vac. Sci. Technol. A 36(3), May/Jun 2018
Date:
2018-02-20
Author Information
| Name | Institution |
|---|---|
| Yong-Ping Wang | Fudan University |
| Zi-Jun Ding | Fudan University |
| Bao Zhu | Fudan University |
| Wen-Jun Liu | Fudan University |
| David Wei Zhang | Fudan University |
| Shi-Jin Ding | Fudan University |
Films
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Diffusion Barrier Properties
Analysis: Custom
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Substrates
| Si(100) |
Notes
| 1203 |