Publication Information

Title:
Atomic layer deposition of amorphous Ni-Ta-N films for Cu diffusion barrier
Type:
Journal
Info:
J. Vac. Sci. Technol. A 36(3), May/Jun 2018
Date:
2018-02-20

Author Information

Name Institution
Yong-Ping WangFudan University
Zi-Jun DingFudan University
Bao ZhuFudan University
Wen-Jun LiuFudan University
David Wei ZhangFudan University
Shi-Jin DingFudan University

Films


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Diffusion Barrier Properties
Analysis: Custom

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Substrates

Si(100)

Keywords

Diffusion Barrier

Notes

1203