Properties of conductive nitride films prepared by plasma enhanced atomic layer deposition using quartz and sapphire plasma sources
Type:
Journal
Info:
J. Vac. Sci. Technol. A 37(1), Jan/Feb 2019
Date:
2018-12-11
Author Information
Name | Institution |
---|---|
Igor Krylov | Technion-Israel Institute of Technology |
Xianbin Xu | Technion-Israel Institute of Technology |
Kamira Weinfeld | Technion-Israel Institute of Technology |
Valentina Korchnoy | Technion-Israel Institute of Technology |
Dan Ritter | Technion-Israel Institute of Technology |
Moshe Eizenberg | Technion-Israel Institute of Technology |
Films
Plasma TiN
Plasma TiN
Plasma TiN
Plasma TaNx
Plasma ZrN
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Substrates
SiO2 |
Notes
1211 |