Publication Information

Title:
Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu
Type:
Poster
Info:
ALD 2009
Date:
2009-07-16
DOI:
No DOI

Author Information

Name Institution
Tae-Kwang EomYeungnam University
Windu SariYeungnam University
Soo-Hyun KimYeungnam University

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: -

Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Diffusion Barrier Properties
Analysis: Anneal

Characteristic: Thermal Stability
Analysis: Anneal

Substrates

Unknown

Keywords

Diffusion Barrier

Notes

70