Publication Information

Title: Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu

Type: Poster

Info: ALD 2009

Date: 2009-07-16

DOI: No DOI

Author Information

Name

Institution

Yeungnam University

Yeungnam University

Yeungnam University

Films

Deposition Temperature Range N/A

0-0-0

0-0-0

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Thickness

Unknown

Unknown

Resistivity, Sheet Resistance

Unknown

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

Unknown

Unknown

Chemical Composition, Impurities

TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

Unknown

Chemical Composition, Impurities

SIMS, Secondary Ion Mass Spectrometry

Unknown

Bonding States

XPS, X-ray Photoelectron Spectroscopy

Unknown

Diffusion Barrier Properties

Anneal

Unknown

Thermal Stability

Anneal

Unknown

Substrates

Unknown

Keywords

Diffusion Barrier

Notes

70



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