Isopropylmethylbenzene Cyclohexadiene Ruthenium, IMBCHRu, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

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NumberTitle
1Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
2Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
3Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma
4Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu
5Formation of Nano-Crystalline Ru-Based Ternary Thin Films by Plasma-Enhanced Atomic Layer Deposition
6Plasma-enhanced atomic layer deposition of amorphous Ru-Si-N thin film as a diffusion barrier of direct plating of Cu