Publication Information

Title:
Atomic layer deposited self-forming Ru-Mn diffusion barrier for seedless Cu interconnects
Type:
Journal
Info:
Journal of Alloys and Compounds, Volume 686, 2016, Pages 1025 - 1031
Date:
2016-06-27

Author Information

Name Institution
Hyun-Jung LeeYeungnam University
Tae Eun HongKorean Basic Science Institute
Soo-Hyun KimYeungnam University

Films

Plasma Ru


Plasma Mn


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: SIMS, Secondary Ion Mass Spectrometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Substrates

SiO2

Keywords

Interconnect
Diffusion Barrier
Seed Layer

Notes

919