
Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer
Type:
Journal
Info:
Surface & Coatings Technology 205 (2011) 5009-5013
Date:
2011-04-29
Author Information
Name | Institution |
---|---|
Seong-Jun Jeong | Korea Advanced Institute of Science and Technology |
Yu-Ri Shin | Pusan National University |
Won-Sub Kwack | Pusan National University |
Hyung Woo Lee | Pusan National University |
Young-Keun Jeong | Pusan National University |
Doo-In Kim | Pusan National University |
Hyun Chang Kim | Mecharonics co. Ltd. |
Se-Hun Kwon | Pusan National University |
Films
Plasma Ir
Plasma Ru
Plasma TaNx
Film/Plasma Properties
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Adhesion
Analysis: Tape Test
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Substrates
TaN |
SiO2 |
Notes
1725 |