Plasma-enhanced atomic layer deposition of Ir thin films for copper adhesion layer

Type:
Journal
Info:
Surface & Coatings Technology 205 (2011) 5009-5013
Date:
2011-04-29

Author Information

Name Institution
Seong-Jun JeongKorea Advanced Institute of Science and Technology
Yu-Ri ShinPusan National University
Won-Sub KwackPusan National University
Hyung Woo LeePusan National University
Young-Keun JeongPusan National University
Doo-In KimPusan National University
Hyun Chang KimMecharonics co. Ltd.
Se-Hun KwonPusan National University

Films


Plasma Ru



Film/Plasma Properties

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Adhesion
Analysis: Tape Test

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Substrates

TaN
SiO2

Notes

1725