
Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
Type:
Conference Proceedings
Info:
ASMC 2015 - SEMI Advanced Semiconductor Manufacturing Conference
Date:
2015-05-03
Author Information
Name | Institution |
---|---|
Dillon Gregory | State University of New York at Albany |
George Marshall | State University of New York at Albany |
Eric T. Eisenbraun | State University of New York at Albany |
Films
Plasma RuCo
Film/Plasma Properties
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Thickness
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
SiO2 |
Notes
626 |