Publication Information

Title:
Emerging Atomic Layer Deposition (ALD) Processes For Low Thermal Budget Flexible Electronics
Type:
Conference Proceedings
Info:
ASMC 2015 - SEMI Advanced Semiconductor Manufacturing Conference
Date:
2015-05-03

Author Information

Name Institution
Dillon GregoryState University of New York at Albany
George MarshallState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films


Film/Plasma Properties

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Thickness
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

SiO2

Keywords

Notes

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