Correlation of carbon content with the thermal stability of ruthenium deposited by using RF-direct plasma-enhanced atomic-layer deposition

Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 53, No. 4, October 2008, pp. 2123~2128
Date:
2008-10-01

Author Information

Name Institution
Myoung-Gyun KoHanyang University
Woong-Sun KimHanyang University
Sang-Kyun ParkHanyang University
Heon-Do KimHanyang University
Jong-Wan ParkHanyang University

Films

Plasma Ru


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thermal Stability
Analysis: Anneal

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Substrates

Silicon

Keywords

Ruthenium
Thermal Stability
Plasma-Enhanced Atomic Layer Deposition
PEALD Film Development

Notes

15