Comparison of mechanical properties and composition of magnetron sputter and plasma enhanced atomic layer deposition aluminum nitride films

Type:
Journal
Info:
J. Vac. Sci. Technol. A 36(5), Sep/Oct 2018
Date:
2018-07-06

Author Information

Name Institution
Perttu SippolaAalto University
Alexander Pyymaki PerrosAalto University
Oili M. E. YlivaaraVTT Technical Research Centre
Helena RonkainenVTT Technical Research Centre
Jaakko JulinUniversity of Jyväskylä
Xuwen LiuAalto University
Timo SajavaaraUniversity of Jyväskylä
Jarkko EtulaAalto University
Harri LipsanenAalto University
Riikka L. PuurunenAalto University

Films

Plasma AlN


Plasma AlN


Film/Plasma Properties

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Morphology, Roughness, Topography
Analysis: XRR, X-Ray Reflectivity

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis

Characteristic: Stress
Analysis: Wafer Curvature

Characteristic: Hardness
Analysis: Nanoindentation

Characteristic: Elastic Modulus
Analysis: Nanoindentation

Characteristic: Adhesion
Analysis: Scratch Testing

Characteristic: Friction Coefficient
Analysis: Reciprocating Sliding Test

Characteristic: Wear Rate
Analysis: Reciprocating Sliding Test

Substrates

Si(100)

Keywords

Notes

1215