Publication Information

Title: Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor

Type: Journal

Info: Nanoscale Research Letters (2019) 14:76

Date: 2019-02-25

DOI: http://dx.doi.org/10.1186/s11671-019-2913-2

Author Information

Name

Institution

Fudan University

Fudan University

Fudan University

Fudan University

Fudan University

Fudan University

Films

Plasma Co using Picosun R200

Deposition Temperature Range = 100-270C

55940-05-1

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Thickness

XRR, X-Ray Reflectivity

Bruker D8 Discover

Density

XRR, X-Ray Reflectivity

Bruker D8 Discover

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Bruker D8 Discover

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Bruker Dimension ICON

Morphology, Roughness, Topography

SEM, Scanning Electron Microscopy

Zeiss Sigma

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

Kratos Analytical Axis Ultra DLD

Bonding States

XPS, X-ray Photoelectron Spectroscopy

Kratos Analytical Axis Ultra DLD

Resistivity, Sheet Resistance

Four-point Probe

Unknown

Substrates

SiO2

Keywords

Diffusion Barrier

Notes

Assume Picosun due to 2800W plasma.

1265



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