Publication Information

Title:
Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
Type:
Journal
Info:
Nanoscale Research Letters (2019) 14:76
Date:
2019-02-25

Author Information

Name Institution
Bao ZhuFudan University
Zi-Jun DingFudan University
Xiaohan WuFudan University
Wen-Jun LiuFudan University
David Wei ZhangFudan University
Shi-Jin DingFudan University

Films

Plasma Co


Film/Plasma Properties

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

SiO2

Keywords

Diffusion Barrier

Notes

Assume Picosun due to 2800W plasma.
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