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Plasma-Enhanced Atomic Layer Deposition of Cobalt Films Using Co(EtCp)2 as a Metal Precursor
Type:
Journal
Info:
Nanoscale Research Letters (2019) 14:76
Date:
2019-02-25
Author Information
| Name | Institution |
|---|---|
| Bao Zhu | Fudan University |
| Zi-Jun Ding | Fudan University |
| Xiaohan Wu | Fudan University |
| Wen-Jun Liu | Fudan University |
| David Wei Zhang | Fudan University |
| Shi-Jin Ding | Fudan University |
Films
Plasma Co
Film/Plasma Properties
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| SiO2 |
Notes
| Assume Picosun due to 2800W plasma. |
| 1265 |