Thermal Versus Plasma-Enhanced ALD: Growth Kinetics and Conformality

Type:
Conference Proceedings
Info:
ECS Transactions, 16 (4) 239-246 (2008)
Date:
2008-10-15

Author Information

Name Institution
Christophe DetavernierGhent University
Jolien DendoovenGhent University
Davy DeduytscheGhent University
Jan MusschootGhent University

Films

Thermal Al2O3


Plasma Al2O3


Plasma Al2O3




Thermal AlN


Plasma AlN


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Characteristic: Conformality, Step Coverage
Analysis: Custom

Substrates

SiO2

Keywords

Plasma vs Thermal Comparison

Notes

1180