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Comparison of plasma-enhanced atomic layer deposition AlN films prepared with different plasma sources

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 37, 020913 (2019)
Date:
2019-01-08
DOI:
http://dx.doi.org/10.1116/1.5079628

Author Information

Name Institution
Małgorzata KotBrandenburg University of Technology
Karsten HenkelBrandenburg University of Technology
Franziska NaumannSentech Instruments GmbH
Hassan GargouriSentech Instruments GmbH
Lidia LupinaIHP - Leibniz-Institut für innovative Mikroelektronik
Viola WilkerBrandenburg University of Technology
Peter KusCharles University
Emilia PoźarowskaBrandenburg University of Technology
Samiran GarainBrandenburg University of Technology
Zied RouissiBrandenburg University of Technology
Dieter SchmeißerBrandenburg University of Technology

Films

Plasma AlN

Hardware used: SENTECH
TMA, Trimethylaluminum, Trimethylalumane, AlMe3, Al(CH3)3
CAS#: 75-24-1
NH3, Ammonia
CAS#: 7664-41-7
Deposition Temperature = 350C

Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: SENTECH SE800

Characteristic: Uniformity
Analysis: Ellipsometry
Diagnostic: SENTECH SE800

Characteristic: Refractive Index
Analysis: Ellipsometry
Diagnostic: SENTECH SE800

Characteristic: Dielectric Constant, Permittivity
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: Agilent 4284A LCR Meter

Characteristic: Fixed Charge
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: Agilent 4284A LCR Meter

Characteristic: Mobile Charge Density
Analysis: C-V, Capacitance-Voltage Measurements
Diagnostic: Agilent 4284A LCR Meter

Characteristic: Breakdown Voltage
Analysis: I-V, Current-Voltage Measurements
Diagnostic: Custom

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Diagnostic: Rigaku Smartlab

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: Tescan Mira

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Veeco Autoprobe CP

Substrates

Silicon

Notes

1249