Challenges in spacer process development for leading-edge high-k metal gate technology
Type:
Journal
Info:
Phys. Status Solidi C 11, No. 1, 73-76 (2014)
Date:
2013-11-01
Author Information
| Name | Institution |
|---|---|
| Fabian Koehler | Global Foundries |
| Dina H. Triyoso | Global Foundries |
| Itasham Hussain | Global Foundries |
| Bianca Antonioli | Global Foundries |
| Klaus Hempel | Global Foundries |
Films
Plasma SiNx
Plasma SiNx
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Wet Etch Resistance
Analysis: Wet Etch
Substrates
Notes
| 100 wafer batches with ~1 hour process time for 5nm. |
| 1371 |