Search Plasma ALD Publication Database By...

Publication Information

Title: Growth of tantalum nitride film as a Cu diffusion barrier by plasma-enhanced atomic layer deposition from bis((2-(dimethylamino)ethyl)(methyl)amido)methyl(tert-butylimido)tantalum complex

Type: Journal

Info: Applied Surface Science 362 (2016) 176 - 181

Date: 2015-11-09

DOI: http://dx.doi.org/10.1016/j.apsusc.2015.11.095

Author Information

Name

Institution

Hanyang University

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Korea Research Institute of Chemical Technology

Films

Plasma TaNx using Unknown

Deposition Temperature Range = 150-250C

0-0-0

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Thickness

Unknown

Unknown

Density

Unknown

Unknown

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

Unknown

Unknown

Resistivity, Sheet Resistance

Unknown

Unknown

Substrates

Silicon

Keywords

Diffusion Barrier

Notes

477

Disclaimer

I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. If you know of publications I have missed or a database entry is wrong, send me an email at: marksowa@plasma-ald.com

Follow plasma-ald.com on Twitter

Follow @PlasmaALDGuy

Shortcuts



© 2014-2018 plasma-ald.com