
Atomic layer deposition of AlN from AlCl3 using NH3 and Ar/NH3 plasma
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 36, 021508 (2018)
Date:
2017-12-29
Author Information
Name | Institution |
---|---|
Ville Rontu | Aalto University |
Perttu Sippola | Aalto University |
Mikael Broas | Aalto University |
Glenn Ross | Aalto University |
Timo Sajavaara | University of Jyväskylä |
Harri Lipsanen | Aalto University |
Mervi Paulasto-Kröckel | Aalto University |
Sami Franssila | Aalto University |
Films
Thermal AlN
Plasma AlN
Film/Plasma Properties
Characteristic: Stress
Analysis: Wafer Curvature
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Refractive Index
Analysis: Ellipsometry
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Compositional Depth Profiling
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Substrates
Si(100) |
Notes
1067 |