Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 30, 01A103 (2012)
Date:
2011-07-20
Author Information
| Name | Institution |
|---|---|
| Johan Swerts | IMEC |
| S. Armini | IMEC |
| L. Carbonell | IMEC |
| Annelies Delabie | IMEC |
| A. Franquet | IMEC |
| S. Mertens | IMEC |
| Mihaela I. Popovici | IMEC |
| Marc Schaekers | IMEC |
| T. Witters | IMEC |
| Z. Tökei | IMEC |
| G. Beyer | IMEC |
| Sven Van Elshocht | IMEC |
| V. Gravey | Applied Materials |
| Andrew Cockburn | Applied Materials |
| K. Shah | Applied Materials |
| Joseph Aubuchon | Applied Materials |
Films
Plasma Ru
Film/Plasma Properties
Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis
Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Substrates
| SiO2 |
| TiN |
| TaN |
Notes
| 666 |