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Publication Information

Title: Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications

Type: Journal

Info: Journal of Vacuum Science & Technology A 30, 01A103 (2012)

Date: 2011-07-20

DOI: http://dx.doi.org/10.1116/1.3625566

Author Information

Name

Institution

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

Applied Materials

Applied Materials

Applied Materials

Applied Materials

Films

Deposition Temperature = 330C

0-0-0

7727-37-9

7664-41-7

Plasma TiN using Unknown

Deposition Temperature = 370C

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Conformality, Step Coverage

TEM, Transmission Electron Microscope

Unknown

Thickness

Ellipsometry

KLA-Tencor Aleris

Thickness

XRR, X-Ray Reflectivity

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

GIXRD, Grazing Incidence X-Ray Diffraction

Unknown

Resistivity, Sheet Resistance

Four-point Probe

KLA-Tencor RS100

Chemical Composition, Impurities

TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

ION TOF IV

Chemical Composition, Impurities

TOF-ERDA, Time-Of-Flight Elastic Recoil Detection Analysis

Unknown

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

Unknown

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Unknown

Substrates

SiO2

TiN

TaN

Keywords

Nucleation

Notes

666


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